Economy of scale effects for large wafer fabs
Oliver RoseAuthors Info & ClaimsAbstract
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Wafer scale patterning by soft UV-nanoimprint lithography
Proceedings of the 29th international conference on micro and nano engineeringWe present first results on wafer scale patterning within one imprint step only, using Soft UV-Nanoimprint Lithography (UV-NIL). In this process, flexible transparent stamps, fabricated by cast moulding ensure a conformal contact, whereas the usage of ...
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- Editors:
- L. Felipe Perrone,
- Barry G. Lawson,
- Jason Liu,
- Frederick P. Wieland,
- General Chair:
- David Nicol,
- Program Chair:
- Richard Fujimoto
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- IIE: Institute of Industrial Engineers
- ASA: American Statistical Association
- IEICE ESS: Institute of Electronics, Information and Communication Engineers, Engineering Sciences Society
- IEEE-CS\DATC: The IEEE Computer Society
- SIGSIM: ACM Special Interest Group on Simulation and Modeling
- NIST: National Institute of Standards and Technology
- (SCS): The Society for Modeling and Simulation International
- INFORMS-CS: Institute for Operations Research and the Management Sciences-College on Simulation
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Winter Simulation Conference
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- IIE
- ASA
- IEICE ESS
- IEEE-CS\DATC
- SIGSIM
- NIST
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- INFORMS-CS
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