research-article

Multi-wafer virtual probe: minimum-cost variation characterization by exploring wafer-to-wafer correlation

Authors:

Wangyang Zhang,

Rob RutenbarAuthors Info & Claims

ICCAD '10: Proceedings of the International Conference on Computer-Aided Design

Pages 47 - 54

Published: 07 November 2010 Publication History

Abstract

In this paper, we propose a new technique, referred to as Multi-Wafer Virtual Probe (MVP) to efficiently model wafer-level spatial variations for nanoscale integrated circuits. Towards this goal, a novel Bayesian inference is derived to extract a shared model template to explore the wafer-to-wafer correlation information within the same lot. In addition, a robust regression algorithm is proposed to automatically detect and remove outliers (i.e., abnormal measurement data with large error) so that they do not bias the modeling results. The proposed MVP method is extensively tested for silicon measurement data collected from 200 wafers at an advanced technology node. Our experimental results demonstrate that MVP offers superior accuracy over other traditional approaches such as VP [7] and EM [8], if a limited number of measurement data are available.

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Cited By

Liao CTao JZeng XSu YZhou DLi XFanucci LTeich J(2016)Efficient spatial variation modeling via robust dictionary learningProceedings of the 2016 Conference on Design, Automation & Test in Europe10.5555/2971808.2971835(121-126)Online publication date: 14-Mar-2016
https://dl.acm.org/doi/10.5555/2971808.2971835
Gonçalves HLi XCorreia MTavares VCarulli JButler KNebel WAtienza D(2015)A fast spatial variation modeling algorithm for efficient test cost reduction of analog/RF circuitsProceedings of the 2015 Design, Automation & Test in Europe Conference & Exhibition10.5555/2755753.2757055(1042-1047)Online publication date: 9-Mar-2015
https://dl.acm.org/doi/10.5555/2755753.2757055
Zhang SLin FHsu CCheng KWang HFettweis GNebel W(2014)Joint virtual probeProceedings of the conference on Design, Automation & Test in Europe10.5555/2616606.2616884(1-6)Online publication date: 24-Mar-2014
https://dl.acm.org/doi/10.5555/2616606.2616884
Show More Cited By

Multi-wafer virtual probe: minimum-cost variation characterization by exploring wafer-to-wafer correlation
1. Computing methodologies
  1. Modeling and simulation
    1. Model development and analysis

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Published In

cover image ACM Conferences

ICCAD '10: Proceedings of the International Conference on Computer-Aided Design

November 2010

863 pages

ISBN:9781424481927

General Chair:
Louis Scheffer
Howard Hughes Medical Institute, Ashburn, VA
,
Program Chairs:
Joel Phillips
Cadence Research Labs, Berkeley, CA
,
Alan J. Hu
Univ. of British Columbia, Vancouver, BC V6T 1Z4 Canada

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SIGDA: ACM Special Interest Group on Design Automation
IEEE CEDA

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IEEE Press

Publication History

Published: 07 November 2010

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ICCAD '10

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SIGDA

ICCAD '10: The International Conference on Computer-Aided Design

November 7 - 11, 2010

California, San Jose

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Overall Acceptance Rate 457 of 1,762 submissions, 26%

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Cited By

Liao CTao JZeng XSu YZhou DLi XFanucci LTeich J(2016)Efficient spatial variation modeling via robust dictionary learningProceedings of the 2016 Conference on Design, Automation & Test in Europe10.5555/2971808.2971835(121-126)Online publication date: 14-Mar-2016
https://dl.acm.org/doi/10.5555/2971808.2971835
Gonçalves HLi XCorreia MTavares VCarulli JButler KNebel WAtienza D(2015)A fast spatial variation modeling algorithm for efficient test cost reduction of analog/RF circuitsProceedings of the 2015 Design, Automation & Test in Europe Conference & Exhibition10.5555/2755753.2757055(1042-1047)Online publication date: 9-Mar-2015
https://dl.acm.org/doi/10.5555/2755753.2757055
Zhang SLin FHsu CCheng KWang HFettweis GNebel W(2014)Joint virtual probeProceedings of the conference on Design, Automation & Test in Europe10.5555/2616606.2616884(1-6)Online publication date: 24-Mar-2014
https://dl.acm.org/doi/10.5555/2616606.2616884
Huang KKupp NCarulli JMakris YMacii E(2013)Handling discontinuous effects in modeling spatial correlation of wafer-level analog/RF testsProceedings of the Conference on Design, Automation and Test in Europe10.5555/2485288.2485425(553-558)Online publication date: 18-Mar-2013
https://dl.acm.org/doi/10.5555/2485288.2485425
Zhang WLi XSaxena SStrojwas ARutenbar R(2013)Automatic clustering of wafer spatial signaturesProceedings of the 50th Annual Design Automation Conference10.1145/2463209.2488821(1-6)Online publication date: 29-May-2013
https://dl.acm.org/doi/10.1145/2463209.2488821
Zhang WBalakrishnan KLi XBoning DRutenbar RPhillips JHu AGraeb H(2011)Toward efficient spatial variation decomposition via sparse regressionProceedings of the International Conference on Computer-Aided Design10.5555/2132325.2132364(162-169)Online publication date: 7-Nov-2011
https://dl.acm.org/doi/10.5555/2132325.2132364

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