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Exploiting DRAM restore time variations in deep sub-micron scaling

Published: 09 March 2015 Publication History

Abstract

Recent studies reveal that one of the major challenges in scaling DRAM in deep sub-micron regime is its significant variations on cell restore time, which affects timing constraints such as write recovery time tWR. Adopting traditional approaches results in either low yield rate or large performance degradation. In this paper, we propose schemes to expose the variations to the architectural level. By constructing memory chunks with different accessing speeds and, in particular, exploiting the performance benefits of fast chunks, a variation-aware memory controller can effectively compensate the performance loss due to relaxed timing constraints. Our experimental results show that, comparing to traditional designs such as row sparing and ECC, the proposed schemes help to improve system performance by up to 10.3% and 12.9%, respectively, for 20nm and 14nm tech nodes on a 4-core multiprocessor system.

References

[1]
"Co-architecting controllers and dram to enhance dram process scaling," in The Memory Forum, 2014.
[2]
Samsung, "Strong 14nm finfet logic process and design infrastructure for advanced mobile soc applications," http://www.samsung.com/global/business/semiconductor/file/media/Samsung_Foundry_14nm_FinFET-0.pdf, 2013.
[3]
R. Goering, "2014 tsmc technology symposium: Full speed ahead for 16nm finfet plus, 10nm, and 7nm," TSMC, Tech. Rep., April 2014.
[4]
M. Mayberry, "Enabling breakthroughs in technology," Intel, Tech. Rep., June 2011.
[5]
International Technology Roadmap for Semiconductors for Semiconductors, "Itrs report, 2012 edition," http://www.itrs.net.
[6]
W. Mueller, G. Aichmayr, et al., "Challenges for the dram cell scaling to 40nm," in International Electron Devices Meeting, 2005.
[7]
K. Kim, "Technology for sub-50nm dram and nand flash manufacturing," in International Electron Devices Meeting, 2005.
[8]
T. Vogelsang, "Understanding the energy consumption of dynamic random access memories," in MICRO, 2010.
[9]
B. Jacob, S. Ng, et al., "Memory systems: Cache, dram, disk," in Morgan Kaufmann, 2007.
[10]
J. Liu, B. Jaiyen, et al., "Raidr: Retention-aware intelligent dram refresh," in ISCA, 2012.
[11]
A. Agrawal, A. Ansari, et al., "Mosaic: Exploiting the spatial locality of process variation to reduce refresh energy in on-chip edram modules," in ISCA, 2014.
[12]
S. R. Sarangi, B. Greskamp, et al., "Varius: A model of process variation and resulting timing errors for microarchitects," IEEE Transactions on Semiconductor Manufacturing, 21(1): 3--13, 2008.
[13]
T. Karnik, S. Borkar, et al., "Probalistic and variation-tolerant design: Key to continued moore's law," in TAU Workshop, 2004.
[14]
Samsung, "What is twr." {Online}. Available: http://www.samsung.com/global/business/semiconductor/file/product/tWR-0.pdf
[15]
J. H. Ahn, N. P. Jouppi, et al., "Future scaling of processor-memory interfaces," in International Conference for High Performance Computing, Networking, Storage and Analysis, 2009.
[16]
H. Zheng, J. Lin, et al., "Mini-rank: Adaptive dram architecture for improving memory power efficiency," in MICRO, 2008.
[17]
"2gb ddr3 sdram data sheet," Hynix Semiconductor, 2010.
[18]
T. Kirihata, Y. Watanabe, et al., "Fault-tolerant designs for 256 mb dram," IEEE Journal of Solid-State Circuits, 31(4): 558--566, 1996.
[19]
I. Koren and C. M. Krishna, Fault-Tolerant Systems. Morgan Kaufmann, 2010.
[20]
C.-L. Su, Y.-T. Yeh, et al., "An integrated ecc and redundancy repair scheme for memory reliability enhancement," in IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems, 2005.
[21]
Y. Kim, V. Seshadriet al., "A Case for Exploiting Subarray-Level Parallelism (SALP) in DRAM," in ISCA, 2012.
[22]
W. Kong, P. Parries, et al., "Analysis of Retention Time Distribution of Embedded DRAM - A New Method to Characterize Across-Chip Threshold Voltage Variation," in International Test Conference, 2008.
[23]
K. Kim, J. Lee, "A New Investigation of Data Retention Time in Truly Nanoscaled DRAMs," in IEEE Electron Device Letters, 30(8): 846--848, 2009.
[24]
J. Kim, M. C. Papaefthymiou, "Block-based Multi-period Refresh for Energy Efficient Dynamic Memory," in IEEE International ASIC/SOC Conference, 2001.
[25]
T. Ohsawa, K. Kai, et al., "Optimizaing the DRAM Refresh Count for Merged DRAM/Logilsis," in ISLPED, 1998.
[26]
R. K. Venkatesan, S. Herr, et al., "Retention-aware Placement in DRAM (rapid): Software Methods for Quasi-non-volatile DRAM," in HPCA, 2006.

Cited By

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  • (2019)CROWProceedings of the 46th International Symposium on Computer Architecture10.1145/3307650.3322231(129-142)Online publication date: 22-Jun-2019
  • (2019)Boosting chipkill capability under retention-error induced reliability emergencyProceedings of the 24th Asia and South Pacific Design Automation Conference10.1145/3287624.3287639(400-405)Online publication date: 21-Jan-2019
  • (2017)AEPProceedings of the 36th International Conference on Computer-Aided Design10.5555/3199700.3199845(1047-1053)Online publication date: 13-Nov-2017
  • Show More Cited By

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  1. Exploiting DRAM restore time variations in deep sub-micron scaling

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      cover image ACM Conferences
      DATE '15: Proceedings of the 2015 Design, Automation & Test in Europe Conference & Exhibition
      March 2015
      1827 pages
      ISBN:9783981537048

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      San Jose, CA, United States

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      Published: 09 March 2015

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      DATE '15
      Sponsor:
      • EDAA
      • EDAC
      • SIGDA
      • Russian Acadamy of Sciences
      DATE '15: Design, Automation and Test in Europe
      March 9 - 13, 2015
      Grenoble, France

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      DATE '15 Paper Acceptance Rate 206 of 915 submissions, 23%;
      Overall Acceptance Rate 518 of 1,794 submissions, 29%

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      March 31 - April 2, 2025
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      Cited By

      View all
      • (2019)CROWProceedings of the 46th International Symposium on Computer Architecture10.1145/3307650.3322231(129-142)Online publication date: 22-Jun-2019
      • (2019)Boosting chipkill capability under retention-error induced reliability emergencyProceedings of the 24th Asia and South Pacific Design Automation Conference10.1145/3287624.3287639(400-405)Online publication date: 21-Jan-2019
      • (2017)AEPProceedings of the 36th International Conference on Computer-Aided Design10.5555/3199700.3199845(1047-1053)Online publication date: 13-Nov-2017
      • (2017)AEPProceedings of the 36th International Conference on Computer-Aided Design10.5555/3199700.3199802(765-771)Online publication date: 13-Nov-2017
      • (2017)Using run-time reverse-engineering to optimize DRAM refreshProceedings of the International Symposium on Memory Systems10.1145/3132402.3132419(115-124)Online publication date: 2-Oct-2017
      • (2017)On the Restore Time Variations of Future DRAM MemoryACM Transactions on Design Automation of Electronic Systems10.1145/296760922:2(1-24)Online publication date: 9-Feb-2017
      • (2016)AWARDProceedings of the Second International Symposium on Memory Systems10.1145/2989081.2989127(322-324)Online publication date: 3-Oct-2016
      • (2016)Image-Content-Aware I/O Optimization for Mobile VirtualizationACM Transactions on Embedded Computing Systems10.1145/295005916:1(1-24)Online publication date: 13-Oct-2016
      • (2015)Achieving Yield, Density and Performance Effective DRAM at Extreme Technology SizesProceedings of the 2015 International Symposium on Memory Systems10.1145/2818950.2818963(78-84)Online publication date: 5-Oct-2015

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