This paper describes the design, fabrication, and characterization of a bulk-micromachined piezoelectric microphone for aeroacoustic applications. Microphone design was accomplished through a combination of piezoelectric composite plate theory and lumped element modeling. The device consists of a 1.80-mm-diam, 3-microm-thick, silicon diaphragm with a 267-nm-thick ring of piezoelectric material placed near the boundary of the diaphragm to maximize sensitivity. The microphone was fabricated by combining a sol-gel lead zirconate-titanate deposition process on a silicon-on-insulator wafer with deep-reactive ion etching for the diaphragm release. Experimental characterization indicates a sensitivity of 1.66 microVPa, dynamic range greater than six orders of magnitude (35.7-169 dB, re 20 microPa), a capacitance of 10.8 nF, and a resonant frequency of 59.0 kHz.