We present a study of powder agglomeration and thermal conductivity in copper-based nanofluids. S... more We present a study of powder agglomeration and thermal conductivity in copper-based nanofluids. Synthesis of the copper powders was achieved by the use of three different surfactants (polyvinylpyrrolidone, oleic acid, and cetyl trimethylammonium bromide). After careful determination of morphology and purity, we systematically and rigorously compared all three of the surfactants for the production of viable copper-based nanofluids using dynamic light scattering. Our results show that the use of surfactants during synthesis of copper nanopowders has important consequences on the dispersion of the powders in a base fluid. The oleic-acid-prepared powders consisted of small particles of 100 nm that did not change with the addition of dispersant. The CTAB-prepared powders exhibited the best dispersion characteristics, as they formed small particles of approximately 80 nm in the presence of SDBS. The thermal conductivity enhancement in our nanofluids exhibited a linear relationship with po...
We present the devitrification behavior of two Fe-based amorphous alloys during spark plasma sint... more We present the devitrification behavior of two Fe-based amorphous alloys during spark plasma sintering. The two compositions of interest are SAM7 (Fe 48 Mo 14 Cr 15 Y 2 C 15 B 6 ) and SAM2X5 (Fe 49.7 Cr 17.7 Mn 1.9 Mo 7.4 W 1.6 B 15.2 C 3.8 Si 2.4 ), both of which have been shown to exhibit outstanding corrosion resistance. We have developed a relationship between crystallite size, time, and temperature of sintering, and propose a time–temperature–crystallinity diagram that is useful for predictive purposes and for guidance on the spark plasma sintering of amorphous metals.
We present an analysis of the dispersion characteristics and thermal conductivity performance of ... more We present an analysis of the dispersion characteristics and thermal conductivity performance of copper-based nanofluids. The copper nanoparticles were prepared using a chemical reduction methodology in the presence of a stabilizing surfactant, oleic acid or cetyl trimethylammonium bromide (CTAB). Nanofluids were prepared using water as the base fluid with copper nanoparticle concentrations of 0.55 and 1.0 vol.%. A dispersing agent, sodium dodecylbenzene sulfonate (SDBS), and subsequent ultrasonication was used to ensure homogenous dispersion of the copper nanopowders in water. Particle size distribution of the copper nanoparticles in the base fluid was determined by dynamic light scattering. We found that the 0.55 vol.% Cu nanofluids exhibited excellent dispersion in the presence of SDBS. In addition, a dynamic thermal conductivity setup was developed and used to measure the thermal conductivity performance of the nanofluids. The 0.55 vol.% Cu nanofluids exhibited a thermal conductivity enhancement of approximately 22%. In the case of the nanofluids prepared from the powders synthesized in the presence of CTAB, the enhancement was approximately 48% over the base fluid for the 1.0 vol.% Cu nanofluids, which is higher than the enhancement values found in the literature. These results can be directly related to the particle/agglomerate size of the copper nanoparticles in water, as determined from dynamic light scattering.
We present a study of powder agglomeration and thermal conductivity in copper-based nanofluids. S... more We present a study of powder agglomeration and thermal conductivity in copper-based nanofluids. Synthesis of the copper powders was achieved by the use of three different surfactants (polyvinylpyrrolidone, oleic acid, and cetyl trimethylammonium bromide). After careful determination of morphology and purity, we systematically and rigorously compared all three of the surfactants for the production of viable copper-based nanofluids using dynamic light scattering. Our results show that the use of surfactants during synthesis of copper nanopowders has important consequences on the dispersion of the powders in a base fluid. The oleic-acid-prepared powders consisted of small particles of 100 nm that did not change with the addition of dispersant. The CTAB-prepared powders exhibited the best dispersion characteristics, as they formed small particles of approximately 80 nm in the presence of SDBS. The thermal conductivity enhancement in our nanofluids exhibited a linear relationship with po...
We present the devitrification behavior of two Fe-based amorphous alloys during spark plasma sint... more We present the devitrification behavior of two Fe-based amorphous alloys during spark plasma sintering. The two compositions of interest are SAM7 (Fe 48 Mo 14 Cr 15 Y 2 C 15 B 6 ) and SAM2X5 (Fe 49.7 Cr 17.7 Mn 1.9 Mo 7.4 W 1.6 B 15.2 C 3.8 Si 2.4 ), both of which have been shown to exhibit outstanding corrosion resistance. We have developed a relationship between crystallite size, time, and temperature of sintering, and propose a time–temperature–crystallinity diagram that is useful for predictive purposes and for guidance on the spark plasma sintering of amorphous metals.
We present an analysis of the dispersion characteristics and thermal conductivity performance of ... more We present an analysis of the dispersion characteristics and thermal conductivity performance of copper-based nanofluids. The copper nanoparticles were prepared using a chemical reduction methodology in the presence of a stabilizing surfactant, oleic acid or cetyl trimethylammonium bromide (CTAB). Nanofluids were prepared using water as the base fluid with copper nanoparticle concentrations of 0.55 and 1.0 vol.%. A dispersing agent, sodium dodecylbenzene sulfonate (SDBS), and subsequent ultrasonication was used to ensure homogenous dispersion of the copper nanopowders in water. Particle size distribution of the copper nanoparticles in the base fluid was determined by dynamic light scattering. We found that the 0.55 vol.% Cu nanofluids exhibited excellent dispersion in the presence of SDBS. In addition, a dynamic thermal conductivity setup was developed and used to measure the thermal conductivity performance of the nanofluids. The 0.55 vol.% Cu nanofluids exhibited a thermal conductivity enhancement of approximately 22%. In the case of the nanofluids prepared from the powders synthesized in the presence of CTAB, the enhancement was approximately 48% over the base fluid for the 1.0 vol.% Cu nanofluids, which is higher than the enhancement values found in the literature. These results can be directly related to the particle/agglomerate size of the copper nanoparticles in water, as determined from dynamic light scattering.
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Papers by Michael Saterlie