Low voltage electrical wiring has largely been dismissed as too noisy and unpredictable to suppor... more Low voltage electrical wiring has largely been dismissed as too noisy and unpredictable to support high-speed communication signals. Advances in communication and modulation methodologies as well as in adaptive digital signal processing and error detection and correction have spawned novel protocols capable of supporting power line communication networks at speeds comparable to wired LANs. We motivate the use of power line LANs as a basic infrastructure for building integrated smart homes, wherein information appliances ranging from simple control or monitoring devices to multimedia entertainment systems are seamlessly interconnected by the very wires that provide them electricity. By simulation and actual measurements using "reference design" prototype commercial powerline products, we show that the HomePlug MAC and PHY layers can guarantee QoS for real-time communications, supporting delay-sensitive data streams for smart home applications.
IEEE Transactions on Antennas and Propagation, Jan 1, 2003
... Butterworth band-pass microstrip filter centered at 2.5 GHz with a 10% fractional bandwidth. ... more ... Butterworth band-pass microstrip filter centered at 2.5 GHz with a 10% fractional bandwidth. ... byusing a continuous periodic strip modulation of the coupled lines width ([50] see ... impedance high-impedance electromagnetic sur-faces with a forbidden frequency band, IEEE Trans ...
The fact that wide bandgap semiconductors are capable of electronic functionality at much higher ... more The fact that wide bandgap semiconductors are capable of electronic functionality at much higher temperatures than silicon has partially fueled their development, particularly in the case of SiC. It appears unlikely that wide bandgap semiconductor devices will find much use in low-power transistor applications until the ambient temperature exceeds approximately 300°C, as commercially available silicon and silicon-on-insulator technologies are already satisfying requirements for digital and analog VLSI in this temperature range. However practical operation of silicon power devices at ambient temperatures above 200°C appears problematic, as self-heating at higher power levels results in high internal junction temperatures and leakages. Thus, most electronic subsystems that simultaneously require high-temperature and high-power operation will necessarily be realized using wide bandgap devices, once they become widely available. Technological challenges impeding the realization of beneficial wide bandgap high ambient temperature electronics, including material growth, contacts, and packaging, are briefly discussed.
This paper endeavors to present a comprehensive summary of the causes and effects of voltage unba... more This paper endeavors to present a comprehensive summary of the causes and effects of voltage unbalance and to discuss related standards, definitions and mitigation techniques. Several causes of voltage unbalance on the power system and in industrial facilities are presented as well as the resulting adverse effects on the system and on equipment such as induction motors and power electronic
The use of networks for communications between the electronic control units (ECU) of a vehicle in... more The use of networks for communications between the electronic control units (ECU) of a vehicle in production cars dates from the beginning of the 1990s. The specific requirements of the different car domains have led to the development of a large number of automotive networks such as Local Interconnect Network, J1850, CAN, TTP/C, FlexRay, media-oriented system transport, IDB1394, etc. This paper first introduces the context of in-vehicle embedded systems and, in particular, the requirements imposed on the communication systems. Then, a comprehensive review of the most widely used automotive networks, as well as the emerging ones, is given. Next, the current efforts of the automotive industry on middleware technologies, which may be of great help in mastering the heterogeneity, are reviewed. Finally, we highlight future trends in the development of automotive communication systems.
Low voltage electrical wiring has largely been dismissed as too noisy and unpredictable to suppor... more Low voltage electrical wiring has largely been dismissed as too noisy and unpredictable to support high-speed communication signals. Advances in communication and modulation methodologies as well as in adaptive digital signal processing and error detection and correction have spawned novel protocols capable of supporting power line communication networks at speeds comparable to wired LANs. We motivate the use of power line LANs as a basic infrastructure for building integrated smart homes, wherein information appliances ranging from simple control or monitoring devices to multimedia entertainment systems are seamlessly interconnected by the very wires that provide them electricity. By simulation and actual measurements using "reference design" prototype commercial powerline products, we show that the HomePlug MAC and PHY layers can guarantee QoS for real-time communications, supporting delay-sensitive data streams for smart home applications.
IEEE Transactions on Antennas and Propagation, Jan 1, 2003
... Butterworth band-pass microstrip filter centered at 2.5 GHz with a 10% fractional bandwidth. ... more ... Butterworth band-pass microstrip filter centered at 2.5 GHz with a 10% fractional bandwidth. ... byusing a continuous periodic strip modulation of the coupled lines width ([50] see ... impedance high-impedance electromagnetic sur-faces with a forbidden frequency band, IEEE Trans ...
The fact that wide bandgap semiconductors are capable of electronic functionality at much higher ... more The fact that wide bandgap semiconductors are capable of electronic functionality at much higher temperatures than silicon has partially fueled their development, particularly in the case of SiC. It appears unlikely that wide bandgap semiconductor devices will find much use in low-power transistor applications until the ambient temperature exceeds approximately 300°C, as commercially available silicon and silicon-on-insulator technologies are already satisfying requirements for digital and analog VLSI in this temperature range. However practical operation of silicon power devices at ambient temperatures above 200°C appears problematic, as self-heating at higher power levels results in high internal junction temperatures and leakages. Thus, most electronic subsystems that simultaneously require high-temperature and high-power operation will necessarily be realized using wide bandgap devices, once they become widely available. Technological challenges impeding the realization of beneficial wide bandgap high ambient temperature electronics, including material growth, contacts, and packaging, are briefly discussed.
This paper endeavors to present a comprehensive summary of the causes and effects of voltage unba... more This paper endeavors to present a comprehensive summary of the causes and effects of voltage unbalance and to discuss related standards, definitions and mitigation techniques. Several causes of voltage unbalance on the power system and in industrial facilities are presented as well as the resulting adverse effects on the system and on equipment such as induction motors and power electronic
The use of networks for communications between the electronic control units (ECU) of a vehicle in... more The use of networks for communications between the electronic control units (ECU) of a vehicle in production cars dates from the beginning of the 1990s. The specific requirements of the different car domains have led to the development of a large number of automotive networks such as Local Interconnect Network, J1850, CAN, TTP/C, FlexRay, media-oriented system transport, IDB1394, etc. This paper first introduces the context of in-vehicle embedded systems and, in particular, the requirements imposed on the communication systems. Then, a comprehensive review of the most widely used automotive networks, as well as the emerging ones, is given. Next, the current efforts of the automotive industry on middleware technologies, which may be of great help in mastering the heterogeneity, are reviewed. Finally, we highlight future trends in the development of automotive communication systems.
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