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ORCIDHerman Oprins
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2020 – today
- 2024
[j9]Leandro Mateus Giacomini Rocha
, Refik Bilgic, Mohamed Naeim, Sudipta Das, Herman Oprins, Amirreza Yousefzadeh, Mario Konijnenburg, Dragomir Milojevic, James Myers, Julien Ryckaert, Dwaipayan Biswas:
Multidie 3-D Stacking of Memory Dominated Neuromorphic Architectures. IEEE Trans. Very Large Scale Integr. Syst. 32(11): 2144-2148 (2024)- [c13]Subrat Mishra, Bjorn Vermeersch, Sankatali Venkateswarlu, Halil Kukner, A. Sharma, G. Mirabeli, Fabian M. Bufler, Moritz Brunion, Dawit Burusie Abdi, Herman Oprins, Dwaipayan Biswas, Odysseas Zografos, Francky Catthoor, Pieter Weckx, Geert Hellings, James Myers, Julien Ryckaert:
Thermal Performance Evaluation of Multi-Core SOCs Using Power-Thermal Co-Simulation. IRPS 2024: 1-6 - [c12]Mohamed Naeim, Herman Oprins, Sudipta Das, Geert Van der Plas, Yun Dai, Pinhong Chen, CT Kao, Dwaipayan Biswas, Dragomir Milojevic:
Thermal Analysis of 3D Stacking and BEOL Technologies with Functional Partitioning of Many-Core RISC-V SoC. ISVLSI 2024: 33-38 - [c11]S. Mishra, Bjorn Vermeersch, Sankatali Venkateswarlu, Halil Kukner, Gioele Mirabelli, Fabian M. Bufler, Moritz Brunion, Dawit Burusie Abdi, Herman Oprins, Dwaipayan Biswas, Odysseas Zografos, Francky Catthoor, Pieter Weckx, Geert Hellings, James Myers, Julien Ryckaert:
Thermal Considerations for Block-Level PPA Assessment in Angstrom Era: A Comparison Study of Nanosheet FETs (A10) & Complementary FETs (A5). VLSI Technology and Circuits 2024: 1-2 - 2023
- [j8]David Coenen, Herman Oprins, Robin Degraeve, Ingrid De Wolf:
Benchmarking of Machine Learning Methods for Multiscale Thermal Simulation of Integrated Circuits. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 42(7): 2264-2275 (2023) - [j7]Sankatali Venkateswarlu, Subrat Mishra, Herman Oprins, Bjorn Vermeersch, Moritz Brunion, Jun-Han Han, Mircea R. Stan, Dwaipayan Biswas, Pieter Weckx, Francky Catthoor:
Impact of 3-D Integration on Thermal Performance of RISC-V MemPool Multicore SOC. IEEE Trans. Very Large Scale Integr. Syst. 31(12): 1896-1904 (2023) - [c10]Melina Lofrano, Herman Oprins, Xinyue Chang, Bjorn Vermeersch, Olalla Varela Pedreira, Alicja Lesniewska, Vladimir Cherman, Ivan Ciofi, Kristof Croes, Seongho Park, Zsolt Tokei:
Towards accurate temperature prediction in BEOL for reliability assessment (Invited). IRPS 2023: 1-7 - [c9]Subrat Mishra, Sankatali Venkateswarlu, Bjorn Vermeersch, Moritz Brunion, Melina Lofrano, Dawit Burusie Abdi, Herman Oprins, Dwaipayan Biswas, Odysseas Zografos, Gaspard Hiblot, Geert Van der Plas, Pieter Weckx, Geert Hellings, James Myers, Francky Catthoor, Julien Ryckaert:
Towards Chip-Package-System Co-optimization of Thermally-limited System-On-Chips (SOCs). IRPS 2023: 1-7 - [c8]David Coenen, Minkyu Kim, Herman Oprins, Ingrid De Wolf, Yoojin Ban, Joris Van Campenhout:
Coupled Dynamic Thermo-Optical Analysis and Compact Modelling of Self-Heating in Ring Modulator. PSC 2023: 1-3 - 2022
- [j6]Sankatali Venkateswarlu, Subrat Mishra, Herman Oprins, Bjorn Vermeersch, Moritz Brunion, Jun-Han Han, Mircea R. Stan, Pieter Weckx, Francky Catthoor:
Thermal Performance Analysis of Mempool RISC-V Multicore SoC. IEEE Trans. Very Large Scale Integr. Syst. 30(11): 1668-1676 (2022)
2010 – 2019
- 2019
- [c7]Kris Croes, Veerle Simons, Sofie Beyne, Vladimir Cherman, Herman Oprins, Michele Stucchi, Philippe Absil, A. Glabman, Eric Wilcox:
Understanding EM-Degradation Mechanisms in Metal Heaters Used for Si Photonics Applications. IRPS 2019: 1-4 - 2016
- [c6]Vice Sodan, Federica Lidia Teresa Maggioni, Herman Oprins, Steve Stoffels, Martine Baelmans, Ingrid De Wolf:
New fast distributed thermal model for analysis of GaN based power devices. ESSDERC 2016: 172-175 - 2015
- [c5]Herman Oprins, Vladimir Cherman, Geert Van der Plas, F. L. T. Maggioni, Joeri De Vos, Eric Beyne:
Thermal experimental and modeling analysis of high power 3D packages. ICICDT 2015: 1-4 - 2014
- [j5]F. L. T. Maggioni, Herman Oprins, Eric Beyne, Ingrid De Wolf, Martine Baelmans:
Fast convolution based thermal model for 3D-ICs: Methodology, accuracy analysis and package impact. Microelectron. J. 45(12): 1746-1752 (2014) - 2012
- [j4]Herman Oprins, Bart Vandevelde, Martine Baelmans:
Modeling and Control of Electrowetting Induced Droplet Motion. Micromachines 3(1): 150-167 (2012) - 2011
- [j3]Geert Van der Plas, Paresh Limaye, Igor Loi, Abdelkarim Mercha, Herman Oprins, Cristina Torregiani, Steven Thijs, Dimitri Linten, Michele Stucchi, Guruprasad Katti, Dimitrios Velenis, Vladimir Cherman, Bart Vandevelde, Veerle Simons, Ingrid De Wolf, Riet Labie, Dan Perry, Stephane Bronckers, Nikolaos Minas, Miro Cupac, Wouter Ruythooren, Jan Van Olmen, Alain Phommahaxay, Muriel de Potter de ten Broeck, Ann Opdebeeck, Michal Rakowski, Bart De Wachter, Morin Dehan, Marc Nelis, Rahul Agarwal, Antonio Pullini, Federico Angiolini, Luca Benini, Wim Dehaene, Youssef Travaly, Eric Beyne, Paul Marchal:
Design Issues and Considerations for Low-Cost 3-D TSV IC Technology. IEEE J. Solid State Circuits 46(1): 293-307 (2011) - [j2]Herman Oprins, Adi Srinivasan, Miroslav Cupák, Vladimir Cherman, Cristina Torregiani, Michele Stucchi, Geert Van der Plas, Paul Marchal, Bart Vandevelde, E. Cheng:
Fine grain thermal modeling and experimental validation of 3D-ICs. Microelectron. J. 42(4): 572-578 (2011) - [c4]Dragomir Milojevic, Herman Oprins, Julien Ryckaert, Paul Marchal, Geert Van der Plas:
DRAM-on-logic Stack - Calibrated thermal and mechanical models integrated into PathFinding flow. CICC 2011: 1-4 - 2010
- [c3]Geert Van der Plas, Steven Thijs, Dimitri Linten, Guruprasad Katti, Paresh Limaye, Abdelkarim Mercha, Michele Stucchi, Herman Oprins, Bart Vandevelde, Nikolaos Minas, Miro Cupac, Morin Dehan, Marc Nelis, Rahul Agarwal, Wim Dehaene, Youssef Travaly, Eric Beyne, Paul Marchal:
Verifying electrical/thermal/thermo-mechanical behavior of a 3D stack - Challenges and solutions. CICC 2010: 1-4 - [c2]Nikolaos Minas, Ingrid De Wolf, Erik Jan Marinissen, Michele Stucchi, Herman Oprins, Abdelkarim Mercha, Geert Van der Plas, Dimitrios Velenis, Pol Marchal:
3D integration: Circuit design, test, and reliability challenges. IOLTS 2010: 217 - [c1]Geert Van der Plas, Paresh Limaye, Abdelkarim Mercha, Herman Oprins, Cristina Torregiani, Steven Thijs, Dimitri Linten, Michele Stucchi, Guruprasad Katti, Dimitrios Velenis, Domae Shinichi, Vladimir Cherman, Bart Vandevelde, Veerle Simons, Ingrid De Wolf, Riet Labie, Dan Perry, Stephane Bronckers, Nikolaos Minas, Miro Cupac, Wouter Ruythooren, Jan Van Olmen, Alain Phommahaxay, Muriel de Potter de ten Broeck, Ann Opdebeeck, Michal Rakowski, Bart De Wachter, Morin Dehan, Marc Nelis, Rahul Agarwal, Wim Dehaene, Youssef Travaly, Pol Marchal, Eric Beyne:
Design issues and considerations for low-cost 3D TSV IC technology. ISSCC 2010: 148-149
2000 – 2009
- 2008
- [j1]Herman Oprins, J. Danneels, B. Van Ham, Bart Vandevelde, Martine Baelmans:
Convection heat transfer in electrostatic actuated liquid droplets for electronics cooling. Microelectron. J. 39(7): 966-974 (2008)
Coauthor Index
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