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ORCIDNegin Golshani
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2020 – today
- 2024
[c6]Jef Van Asch, Jeroen Missinne, Junwen He, Pengfei Xu, Arnita Podpod, Guy Lepage, Negin Golshani, Rafal Magdziak, Huseyin Sar, Hakim Kobbi, Swetanshu Bipul, Dieter Bode, Yoojin Ban, Filippo Ferraro, Joris Van Campenhout, Geert Van Steenberge:
Sub-1 dB Loss SiN-to-Polymer Waveguide Coupling: an Enabler for Co-Packaged Optics. OFC 2024: 1-3- [c5]Pengfei Xu, Junwen He, Koen Kennes, Anton Dvoretskii, Arnita Podpod, Guy Lepage, Negin Golshani, Rafal Magdziak, Swetanshu Bipul, Dieter Bode, Peter Verheyen, Maumita Chakrabarti, Dimitrios Velenis, Andy Miller, Yoojin Ban, Filippo Ferraro, Joris Van Campenhout:
Collective die-to-wafer bonding enabling low-loss evanescent coupling for optically interconnected System-on-Wafer. OFC 2024: 1-3 - [c4]Pengfei Xu, Chiara Marchese, Guy Lepage, Negin Golshani, Ruben Van Eenaeme, Andrea Mingardi, Joost Van Ongeval, Rafal Magdziak, Luc Halipre, Darko Trivkovic, Peter Verheyen, Maumita Chakrabarti, Dimitrios Velenis, Andy Miller, Filippo Ferraro, Yoojin Ban, Joris Van Campenhout:
Low-loss, multi-reticle stitched SiN waveguides for 300mm wafer-level optical interconnects. OFC 2024: 1-3
2010 – 2019
- 2018
- [c3]Joris Van Campenhout, Yoojin Ban, Peter De Heyn, Ashwyn Srinivasan, Jeroen De Coster, Sebastien Lardenois, Brad Snyder, Sadhishkumar Balakrishnan, Guy Lepage, Negin Golshani, Sofie Janssen, Alicja Lesniewska, Kristof Croes, Andy Miller, Peter Verheyen, Marianna Pantouvaki, Philippe Absil:
Silicon Photonics for 56G NRZ Optical Interconnects. OFC 2018: 1-3 - 2014
- [j1]Ryoichi Ishihara, Jin Zhang, Miki Trifunovic, Jaber Derakhshandeh, Negin Golshani, Daniel M. R. Tajari Mofrad, Tao Chen, Kees Beenakker, Tatsuya Shimoda:
Single-Grain Si Thin-Film Transistors for Monolithic 3D-ICs and Flexible Electronics. IEICE Trans. Electron. 97-C(4): 227-237 (2014) - 2013
- [c2]Negin Golshani, Vahid Mohammadi, Siva Ramesh, Lis K. Nanver:
High-ohmic resistors using nanometer-thin pure-boron chemical-vapour-deposited layers. ESSDERC 2013: 210-213 - 2010
- [c1]Negin Golshani, Jaber Derakhshandeh, Ryoichi Ishihara, C. I. M. Beenakker, Michael Robertson, Thomas Morrison:
Monolithic 3D integration of SRAM and image sensor using two layers of single grain silicon. 3DIC 2010: 1-4
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