"A 283.2μW 800Mb/s/pin DLL-based data self-aligner for Through-Silicon ..."

Hyun-Woo Lee et al. (2012)

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DOI: 10.1109/ISSCC.2012.6176873

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-17

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Hyun-Woo Lee, Soo-Bin Lim, Junyoung Song, Jabeom Koo, Dae-Han Kwon, Jong-Ho Kang, Yunsaing Kim, Young-Jung Choi, Kunwoo Park, Byong-Tae Chung, Chulwoo Kim:
A 283.2μW 800Mb/s/pin DLL-based data self-aligner for Through-Silicon Via (TSV) interface. ISSCC 2012: 48-50

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