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Microelectronics Reliability, Volume 84
Volume 84, May 2018
- Donald A. Gajewski, Satyaki Ganguly, Scott T. Sheppard, Simon Wood, Jeff B. Barner, Jim W. Milligan, John Palmour:
Reliability comparison of 28V-50V GaN-on-SiC S-band and X-band technologies. 1-6
- Lukás Kohútka
, Viera Stopjaková
:
Reliable real-time task scheduler based on Rocket Queue architecture. 7-19 - Tao Hu, Shurong Dong, Hao Jin, Hei Wong
, Zekun Xu, Xiang Li, Juin J. Liou:
A double snapback SCR ESD protection scheme for 28 nm CMOS process. 20-25 - Hosung Lee
, Sanghyeon Baeg:
Signal characteristic and test exploitation for intermittent nanometer-scale cracks. 26-36 - I. Gabsi, Samah Maalej, Mohamed Chaker Zaghdoudi
:
Thermal performance modeling of loop heat pipes with flat evaporator for electronics cooling. 37-47 - Shao-Chang Huang, Hung-Wei Chen
, Jen-Hang Yang, Mi-Chang Chang:
Improving ESD protection of 5V NMOSFET large array device in 0.4μm BCD process. 48-54 - Jianfeng Li
, Jingru Dai, Christopher Mark Johnson
:
Comparison of power cycling reliability of flexible PCB interconnect smaller/thinner and larger/thicker power devices with topside Sn-3.5Ag solder joints. 55-65 - Bijender Kumar
, Neeta Khare, P. K. Chaturvedi:
FPGA-based design of advanced BMS implementing SoC/SoH estimators. 66-74 - Jin-Cherng Shyu
, Shu-Kai Jheng:
Cooling performance and characteristics of metal piezoelectric fans in a heat sink-equipped handheld projector. 75-87 - Tibor Rovensky, Alena Pietrikova
, Igor Vehec
, Lubomir Livovsky
:
Stability of miniaturized non-trimmed thick- and thin-film resistors. 88-94
- Arkadiusz Dabrowski, Andrzej Dziedzic
:
Stability of low ohmic thick-film resistors under pulsed operation. 95-104 - Jinxin Zhang, Qi Guo, Hongxia Guo, Wu Lu, Chaohui He, Xin Wang, Pei Li, Lin Wen:
Investigation of enhanced low dose rate sensitivity in SiGe HBTs by 60Co γ irradiation under different biases. 105-111 - Vinicius Fratin
, Daniel Oliveira
, Philippe O. A. Navaux, Luigi Carro, Paolo Rech
:
Energy-Delay-FIT Product to compare processors and algorithm implementations. 112-120 - Krzysztof Nieweglowski, Lukas Lorenz, Sebastian Lüngen, Tobias Tiedje, Klaus-Jürgen Wolter, Karlheinz Bock:
Optical coupling with flexible polymer waveguides for chip-to-chip interconnects in electronic systems. 121-126 - Yutaka Komatsu, Seira Yamaguchi
, Atsushi Masuda, Keisuke Ohdaira
:
Multistage performance deterioration in n-type crystalline silicon photovoltaic modules undergoing potential-induced degradation. 127-133 - Ke Zhao, Boan Pan, Zebing Li, Fulin Zhong, Pengbo Wang, Ting Li:
Performance evaluation for a novel optoelectronic device for noninvasive monitoring thrombosis. 134-139
- Jiajie Fan
, Jianwu Cao, Chaohua Yu, Cheng Qian, Xuejun Fan
, Guoqi Zhang:
A design and qualification of LED flip Chip-on-Board module with tunable color temperatures. 140-148 - J. Lynn Davis
, Karmann C. Mills
, Georgiy V. Bobashev, Kelley J. Rountree
, Michael Lamvik, Robert Yaga, Cortina Johnson:
Understanding chromaticity shifts in LED devices through analytical models. 149-156 - Zhaozhao Xu
, Donghua Liu, Wei Xiong, Jun Hu, Wenting Duan, Hualun Chen, Wensheng Qian, Weiran Kong, Shichang Zou:
Investigation and impact of LDD variations on the drain disturb in normally-on SONOS NOR flash device. 157-162
- Lukasz Wozniak, Pawel Kalinowski
, Grzegorz Jasinski
, Piotr Jasinski
:
FFT analysis of temperature modulated semiconductor gas sensor response for the prediction of ammonia concentration under humidity interference. 163-169 - Shi-Qian Liu
, Stuart D. McDonald
, Keith W. Sweatman, Kazuhiro Nogita
:
The effects of precipitation strengthening and solid solution strengthening on strain rate sensitivity of lead-free solders: Review. 170-180 - Gennady I. Zebrev
, Vasily V. Orlov, Maxim S. Gorbunov, Maxim G. Drosdetsky:
Physics-based modeling of TID induced global static leakage in different CMOS circuits. 181-186
- Xiao-Jing Yin, Bangcheng Zhang, Zhi-Jie Zhou
, Xiaoxia Han, Zhanli Wang, Guan-Yu Hu:
A new health estimation model for CNC machine tool based on infinite irrelevance and belief rule base. 187-196 - Subramani Manoharan, Chandradip Patel, F. Patrick McCluskey, Michael G. Pecht:
Effective decapsulation of copper wire-bonded microelectronic devices for reliability assessment. 197-207
- Ibrahim Khalilullah, Talukder Reza, Liangbiao Chen, Mark D. Placette, A. K. M. Monayem H. Mazumder, Jiang Zhou
, Jiajie Fan
, Cheng Qian, Guoqi Zhang, Xuejun Fan
:
In-situ characterization of moisture absorption and hygroscopic swelling of silicone/phosphor composite film and epoxy mold compound in LED packaging. 208-214
- Yujie Zhang, Lulu Wang, Shaonian Wang, Peng Wang, Haitao Liao, Yu Peng:
Auxiliary power unit failure prediction using quantified generalized renewal process. 215-225 - Yiming Lei, Hitoshi Wakabayashi, Kazuo Tsutsui, Hiroshi Iwai, Masayuki Furuhashi, Shingo Tomohisa, Satoshi Yamakawa, Kuniyuki Kakushima:
Improvement of SiO2/4H-SiC Interface properties by post-metallization annealing. 226-229 - Srivalli Chellvarajoo, Mohd Zulkifly Abdullah
:
Investigation on nano-reinforced solder paste after reflow soldering part 1: Effects of nano-reinforced solder paste on melting, hardness, spreading rate, and wetting quality. 230-237 - Mohammad A. Gharaibeh
:
Reliability analysis of vibrating electronic assemblies using analytical solutions and response surface methodology. 238-247 - Yiming Lei, Hitoshi Wakabayashi, Kazuo Tsutsui, Hiroshi Iwai, Masayuki Furuhashi, Shingo Tomohisa, Satoshi Yamakawa, Kuniyuki Kakushima:
Effect of lanthanum silicate interface layer on the electrical characteristics of 4H-SiC metal-oxide-semiconductor capacitors. 248-252 - Benkuan Wang, Datong Liu
, Wenjuan Wang, Xiyuan Peng:
A hybrid approach for UAV flight data estimation and prediction based on flight mode recognition. 253-262
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