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ORCIDMicroelectronics Reliability, Volume 86
Volume 86, July 2018
- Thomas Wlanis, René Hammer
, Werner Ecker, Sandrine Lhostis, Clément Sart, Sébastien Gallois-Garreignot, Bernhard Rebhan, Günther A. Maier:
Cu-SiO2 hybrid bonding simulation including surface roughness and viscoplastic material modeling: A critical comparison of 2D and 3D modeling approach. 1-9
- Tomasz Raszkowski, Agnieszka Samson, Mariusz Zubert:
Influence of temperature and heat flux time lags on the temperature distribution in modern GAAFET structure based on Dual-Phase-Lag thermal model. 10-19 - Marcin Janicki, Tomasz Torzewicz, Agnieszka Samson, Tomasz Raszkowski, Andrzej Napieralski:
Experimental identification of LED compact thermal model element values. 20-26 - Yongqiang Wan, Shuang Li, Xiaowu Hu, Yu Qiu, Tao Xu, Yulong Li, Xiongxin Jiang:
Shear strength and fracture surface analysis of Sn58Bi/Cu solder joints under a wide range of strain rates. 27-37 - Stefan Kristofík, Marcel Baláz, Peter Malík:
Hardware redundancy architecture based on reconfigurable logic blocks with persistent high reliability improvement. 38-53 - Riikka Mikkonen, Matti Mäntysalo:
Evaluation of screen printed silver trace performance and long-term reliability against environmental stress on a low surface energy substrate. 54-65 - Kyeonggon Choi, Dong-Youl Yu, Sungdo Ahn, Kyoung-Ho Kim, Jung-Hwan Bang, Yong-Ho Ko:
Joint reliability of various Pb-free solders under harsh vibration conditions for automotive electronics. 66-71 - Ting Li, Zebin Li, Ke Zhao, Boan Pan, Zhiyuan Wang, Xiping Yang:
Reliability analysis of a mini-instrument for simultaneous monitoring water content, deep tissue temperature, and hemodynamic parameters. 72-76 - Nam Nguyen, Van-Quyen Dinh, Tung Nguyen-Duc, Quoc-Tuan Ta, Xuan-Viet Dao, Thanh-Huy Pham, Trung-Kien Nguyen-Duc:
Effect of potting materials on LED bulb's driver temperature. 77-81 - Wasma Hanini, Moez Ayadi:
Electro thermal modeling of the power diode using Pspice. 82-91 - Jorge Martínez, Mert Atamaner, Pedro Reviriego, Oguz Ergin, Marco Ottavi:
Opcode vector: An efficient scheme to detect soft errors in instructions. 92-97
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