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3D Integration for NoC-based SoC Architectures 2011
- Abbas Sheibanyrad, Frédéric Pétrot, Axel Jantsch:
3D Integration for NoC-based SoC Architectures. Integrated Circuits and Systems, Springer 2011, ISBN 978-1-4419-7617-8 - Chuan Seng Tan:
Three-Dimensional Integration of Integrated Circuits - an Introduction. 3-26 - Axel Jantsch, Matthew Grange, Dinesh Pamunuwa:
The Promises and Limitations of 3-D Integration. 27-44 - Erik Jan Marinissen:
Testing 3D Stacked ICs Containing Through-Silicon Vias. 47-74 - Paul D. Franzon, W. Rhett Davis, Thorlindur Thorolfsson:
Design and Computer Aided Design of 3DIC. 75-88 - Vasilis F. Pavlidis, Eby G. Friedman:
Physical Analysis of NoC Topologies for 3-D Integrated Systems. 89-114 - Brett Stanley Feero, Partha Pratim Pande:
Three-Dimensional Networks-on-Chip: Performance Evaluation. 115-145 - Abbas Sheibanyrad, Frédéric Pétrot:
Asynchronous 3D-NoCs Making Use of Serialized Vertical Links. 149-165 - Shan Yan, Bill Lin:
Design of Application-Specific 3D Networks-on-Chip Architectures. 167-191 - Ciprian Seiculescu, Srinivasan Murali, Luca Benini, Giovanni De Micheli:
3D Network on Chip Topology Synthesis: Designing Custom Topologies for Chip Stacks. 193-223 - Hiroki Matsutani, Michihiro Koibuchi, Tadahiro Kuroda, Hideharu Amano:
3-D NoC on Inductive Wireless Interconnect. 225-248 - Ahmed Al-Maashri, Guangyu Sun, Xiangyu Dong, Yuan Xie, Narayanan Vijaykrishnan:
Influence of Stacked 3D Memory/Cache Architectures on GPUs. 249-271
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