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Doug C. H. Yu

Douglas C. H. Yu

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2020 – today

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2023
[c5]
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Chih-Hang Tung, Doug C. H. Yu:
An Integrated System Scaling Solution for Future High Performance Computing. VLSI Technology and Circuits 2023: 1-2
2022
[c4]
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Chuei-Tang Wang, Chia-Chai Lin, Chih-Hsin Lu, Wei-Ting Chen, Chung-Hao Tsai, Douglas C. H. Yu:
SoIC_H Technology for Heterogenous System Integration. VLSI Technology and Circuits 2022: 258-259
2021
[c3]
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C. J. Wu, S. T. Hsiao, J. Y. Wang, W. H. Lin, C. W. Chang, T. L. Shao, C. H. Tung, Doug C. H. Yu:
Ultra High Power Cooling Solution for 3D-ICs. VLSI Circuits 2021: 1-2

2010 – 2019

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2015
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Chuei-Tang Wang, Jeng-Shien Hsieh, Victor C. Y. Chang, En-Hsiang Yeh, Feng-Wei Kuo, Hsu-Hsien Chen, Chih-Hua Chen, Huan-Neng Ron Chen, Ying-Ta Lu, Chewnpu Jou, Hao-Yi Tsai, C. S. Liu, Doug C. H. Yu:
Power saving and noise reduction of 28nm CMOS RF system integration using integrated fan-out wafer level packaging (InFO-WLP) technology. 3DIC 2015: TS6.3.1-TS6.3.4
2014
[c1]
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Doug C. H. Yu:
New System-in-Package (SiP) Integration technologies. CICC 2014: 1-6

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