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ORCIDWolfgang Scholl
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2020 – today
- 2023
[c20]Wolfgang Scholl, Patrick Preuss, Christoph Laroque, Madlene Leißau:
Backward Simulation: A Customer-Focused Diversification of Fab Simulation Applications in a Highly Automated Semiconductor Production Line. WSC 2023: 2276-2285- 2021
- [c19]Igor Stogniy, Wolfgang Scholl:
Using representative process flows for simulation model simplification. ICIT 2021: 1432-1437 - [c18]Christoph Laroque, Madlene Leißau, Wolfgang Scholl, Germar Schneider:
Backward Simulation for Production Planning - Recent Advances in a Real-World Use-Case. WSC 2021: 1-10 - [c17]Igor Stogniy, Wolfgang Scholl, Hans Ehm:
Simulation Model Simplification For Changing Product Mix Scenario. WSC 2021: 1-12 - 2020
- [c16]Georg Seidel, Ching Foong Lee, Aik Ying Tang, Soo Leen Low, Boon Ping Gan, Wolfgang Scholl:
Challenges Associated with Realization of Lot Level Fab Out Forecast in a Giga Wafer Fabrication Plant. WSC 2020: 1777-1788 - [c15]Igor Stogniy, Wolfgang Scholl:
Using Accuracy Measurements to Evaluate Simulation Model Simplification. WSC 2020: 1825-1836
2010 – 2019
- 2019
- [c14]Igor Stogniy, Wolfgang Scholl:
Using Delays for Process flow Simplification. WSC 2019: 2372-2383 - 2018
- [c13]Wolfgang Scholl, Matthias Forster, Patrick Preuss, André Naumann, Hui Ping Ooi, Boon-Ping Gan:
Bridging the Gap between fab simulation and supply Chain Forecast. WSC 2018: 3461-3469 - 2016
- [c12]Wolfgang Scholl, Matthias Forster, Patrick Preuss, André Naumann, Boon-Ping Gan, Peter Lendermann:
Simulation-enabled development lot journey smoothening in a fully-utilised semiconductor manufacturing line. WSC 2016: 2559-2567 - 2014
- [c11]Patrick Preuss, André Naumann, Wolfgang Scholl, Boon-Ping Gan, Peter Lendermann:
Enhancement of simulation-based semiconductor manufacturing forecast quality through hybrid tool down time modeling. WSC 2014: 2444-2453 - [c10]Wolfgang Scholl, Christoph Laroque
, Gerald Weigert:
Evaluations on scheduling in semiconductor manufacturing by backward simulation. WSC 2014: 2552-2560 - 2013
- [c9]Boon-Ping Gan, Peter Lendermann, Wolfgang Scholl, Marcin Mosinski, Patrick Preuss:
Automatic model verification for semiconductor manufacturing simulation. WSC 2013: 3858-3865 - 2012
- [c8]Wolfgang Scholl, Marcin Mosinski, Boon-Ping Gan, Peter Lendermann, Patrick Preuss, Daniel Noack:
A multi-stage discrete event simulation approach for scheduling of maintenance activities in a semiconductor manufacturing line. WSC 2012: 202:1-202:10 - 2011
- [c7]Marcin Mosinski, Daniel Noack, Falk Stefan Pappert, Oliver Rose, Wolfgang Scholl:
Cluster based analytical method for the lot delivery forecast in semiconductor fab with wide product range. WSC 2011: 1834-1844 - [c6]Daniel Noack, Marcin Mosinski, Oliver Rose, Peter Lendermann, Boon-Ping Gan, Wolfgang Scholl:
Challenges and solution approaches for the online simulation of semiconductor wafer fabs. WSC 2011: 1845-1856 - [c5]Wolfgang Scholl, Daniel Noack, Oliver Rose, Boon-Ping Gan, Peter Lendermann, Patrick Preuss, Falk Stefan Pappert:
Implementation of a simulation-based short-term lot arrival forecast in a mature 200mm semiconductor fab. WSC 2011: 1932-1943 - 2010
- [c4]Wolfgang Scholl, Boon-Ping Gan, Ming Li Peh, Peter Lendermann, Daniel Noack, Oliver Rose, Patrick Preuss:
Towards realization of a high-fidelity simulation model for short-term horizon forecasting in wafer fabrication facilities. WSC 2010: 2563-2574
2000 – 2009
- 2009
- [c3]Chaehan So, Wolfgang Scholl:
Perceptive Agile Measurement: New Instruments for Quantitative Studies in the Pursuit of the Social-Psychological Effect of Agile Practices. XP 2009: 83-93 - 2008
- [c2]Wolfgang Scholl:
Coping with typical unpredictable incidents in a logic fab. WSC 2008: 2030-2034 - 2005
- [c1]Bertolt Meyer, Wolfgang Scholl:
A Comparison of Paradigmatic Views in Knowledge Management: An Empirical Case Study on Shortcomings in KM. Wirtschaftsinformatik 2005: 1003-1022 - 2004
- [j1]Wolfgang Scholl, Christine König, Bertolt Meyer, Peter Heisig:
The future of knowledge management: an international delphi study. J. Knowl. Manag. 8(2): 19-35 (2004)
Coauthor Index
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