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Anmin Hu
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2020 – today
- 2022
- [i1]Gaode Chen, Yijun Su, Xinghua Zhang
, Anmin Hu, Guochun Chen, Siyuan Feng, Ji Xiang, Junbo Zhang, Yu Zheng:
A Cross-City Federated Transfer Learning Framework: A Case Study on Urban Region Profiling. CoRR abs/2206.00007 (2022)
2010 – 2019
- 2019
- [c2]Anmin Hu, Lijun Zhang:
Adaptive Indoor Localization with Wi-Fi Based on Transfer Learning. ICCE-TW 2019: 1-2 - 2014
- [j7]Jiaxing Liang, Tingbi Luo, Anmin Hu, Ming Li:
Formation and growth of interfacial intermetallic layers of Sn-8Zn-3Bi-0.3Cr on Cu, Ni and Ni-W substrates. Microelectron. Reliab. 54(1): 245-251 (2014) - 2013
- [j6]Qinghua Zhao, Anmin Hu, Ming Li, Jiangyan Sun:
Effect of electroplating layer structure on shear property and microstructure of multilayer electroplated Sn-3.5Ag solder bumps. Microelectron. Reliab. 53(2): 321-326 (2013) - [j5]Tingbi Luo, Zhuo Chen, Anmin Hu, Ming Li, Peng Li:
Study on low-Ag content Sn-Ag-Zn/Cu solder joints. Microelectron. Reliab. 53(12): 2018-2029 (2013) - 2012
- [j4]Tingbi Luo, Anmin Hu, Jing Hu, Ming Li, Dali Mao:
Microstructure and mechanical properties of Sn-Zn-Bi-Cr lead-free solder. Microelectron. Reliab. 52(3): 585-588 (2012) - [j3]Wenjing Zhang, Wei Luo, Anmin Hu, Ming Li:
Adhesion improvement of Cu-based substrate and epoxy molding compound interface by hierarchical structure preparation. Microelectron. Reliab. 52(6): 1157-1164 (2012) - 2011
- [j2]Jinglin Bi, Anmin Hu, Jing Hu, Tingbi Luo, Ming Li, Dali Mao:
Effect of Cr additions on interfacial reaction between the Sn-Zn-Bi solder and Cu/electroplated Ni substrates. Microelectron. Reliab. 51(3): 636-641 (2011) - [j1]Wenyan Gen, Xi Chen, Anmin Hu, Ming Li:
Effect of Ag on oxidation of Cu-base leadframe. Microelectron. Reliab. 51(4): 866-870 (2011)
1990 – 1999
- 1998
- [c1]Brian D. Corner, Anmin Hu:
Effect of Sway on Image Fidelity in Whole-body Digitizing. Three-Dimensional Image Capture and Applications 1998: 90-101
Coauthor Index
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