"Temperature Cycling Reliability of WOW Bumpless Through Silicon Vias."

Chia-Hsuan Lee et al. (2019)

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DOI: 10.1109/3DIC48104.2019.9058776

access: closed

type: Conference or Workshop Paper

metadata version: 2021-11-03

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Chia-Hsuan Lee, Hsin-Chi Chang, Jui-Han Liu, Hiroyuki Ito, Young-Suk Kim, Kuan-Neng Chen, Takayuki Ohba:
Temperature Cycling Reliability of WOW Bumpless Through Silicon Vias. 3DIC 2019: 1-4

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