"Temporary Adhesive Effect on Multichip Thinning for Rapid Prototyping of ..."

Akihiro Tominaga et al. (2024)

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DOI: 10.1109/3DIC63395.2024.10830079

access: closed

type: Conference or Workshop Paper

metadata version: 2025-01-23

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Akihiro Tominaga, Jiayi Shen, Chang Liu, Atsushi Shinoda, Tetsu Tanaka, Takafumi Fukushima:
Temporary Adhesive Effect on Multichip Thinning for Rapid Prototyping of 3D-IC from 2D-IC Fabricated in Foundry Shuttle Services. 3DIC 2024: 1-3

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