"Test Cost Analysis for 3D Die-to-Wafer Stacking."

Mottaqiallah Taouil et al. (2010)

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DOI: 10.1109/ATS.2010.80

access: closed

type: Conference or Workshop Paper

metadata version: 2024-02-05

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Mottaqiallah Taouil, Said Hamdioui, Kees Beenakker, Erik Jan Marinissen:
Test Cost Analysis for 3D Die-to-Wafer Stacking. Asian Test Symposium 2010: 435-441

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