"Interconnect in the Era of 3DIC."

Shenggao Li et al. (2022)

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DOI: 10.1109/CICC53496.2022.9772820

access: closed

type: Conference or Workshop Paper

metadata version: 2023-09-30

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Shenggao Li, Mu-Shan Lin, Wei-Chih Chen, Chien-Chun Tsai:
Interconnect in the Era of 3DIC. CICC 2022: 1-5

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