"From fan-out wafer to fan-out panel level packaging."

Tanja Braun et al. (2015)

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DOI: 10.1109/ECCTD.2015.7300046

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-26

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  - https://dblp.org/rec/conf/ecctd/BraunBRBBAVTKL15
Tanja Braun, K.-F. Becker, S. Raatz, V. Bader, Jörg Bauer, Rolf Aschenbrenner, S. Voges, Tina Thomas, R. Kahle, Klaus-Dieter Lang:
From fan-out wafer to fan-out panel level packaging. ECCTD 2015: 1-4

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