"3D Stacked IC layout considering bond pad density and doubling for ..."

Ding-Ming Kwai, Chang-Tzu Lin (2011)

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DOI: 10.1109/ISQED.2011.5770715

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-25

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Ding-Ming Kwai, Chang-Tzu Lin:
3D Stacked IC layout considering bond pad density and doubling for manufacturing yield improvement. ISQED 2011: 129-134

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