"Toward 0 V ESD Protection in 2.5D/3D Advanced Bonding Technology."

S.-H. Lin et al. (2024)

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DOI: 10.1109/VLSITECHNOLOGYANDCIR46783.2024.10631467

access: closed

type: Conference or Workshop Paper

metadata version: 2024-10-17

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S.-H. Lin, Marko Simicic, N. Pantano, S.-H. Chen, Geert Van der Plas, Eric Beyne, Piet Wambacq:
Toward 0 V ESD Protection in 2.5D/3D Advanced Bonding Technology. VLSI Technology and Circuits 2024: 1-2

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