"Investigation of the influence of thermal treatment on ..."

Oliver Aubel et al. (2006)

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DOI: 10.1016/J.MICROREL.2005.10.010

access: closed

type: Journal Article

metadata version: 2020-02-22

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Oliver Aubel, Eberhard Bugiel, Dietmar Krüger, Wolfgang Hasse, Martina Hommel:
Investigation of the influence of thermal treatment on interconnect-barrier interfaces in copper metallization systems. Microelectron. Reliab. 46(5-6): 768-773 (2006)

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