"Optimal design towards enhancement of board-level thermomechanical ..."

Yi-Shao Lai, Tong Hong Wang (2007)

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DOI: 10.1016/J.MICROREL.2006.04.008

access: closed

type: Journal Article

metadata version: 2020-02-22

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Yi-Shao Lai, Tong Hong Wang:
Optimal design towards enhancement of board-level thermomechanical reliability of wafer-level chip-scale packages. Microelectron. Reliab. 47(1): 104-110 (2007)

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