"Analytical Die-to-Die 3-D Placement With Bistratal Wirelength Model and ..."

Peiyu Liao et al. (2024)

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DOI: 10.1109/TCAD.2023.3347293

access: closed

type: Journal Article

metadata version: 2024-06-18

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Peiyu Liao, Yuxuan Zhao, Dawei Guo, Yibo Lin, Bei Yu:
Analytical Die-to-Die 3-D Placement With Bistratal Wirelength Model and GPU Acceleration. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 43(6): 1624-1637 (2024)

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