"Low-Cost Post-Bond Testing of 3-D ICs Containing a Passive Silicon ..."

Chun-Chuan Chi et al. (2014)

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DOI: 10.1109/TVLSI.2013.2293192

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type: Journal Article

metadata version: 2024-02-05

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Chun-Chuan Chi, Erik Jan Marinissen, Sandeep Kumar Goel, Cheng-Wen Wu:
Low-Cost Post-Bond Testing of 3-D ICs Containing a Passive Silicon Interposer Base. IEEE Trans. Very Large Scale Integr. Syst. 22(11): 2388-2401 (2014)

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