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ORCIDJournal of Computer Applications in Technology, Volume 29
Volume 29, Number 1, 2007
- Lykourgos Petropoulakis, Frances Flood:
Design and development of a general purpose collaborative environment. 2-10 - Robin Wolff, David J. Roberts, Anthony Steed
, Oliver Otto:
A review of telecollaboration technologies with respect to closely coupled collaboration. 11-26 - Kevin W. Gorman, Daneyand Singley, Yuichi Motai:
Synchronous collaborative systems for distributed virtual environments in Java. 27-36 - Chun-Feng Liao, Tsai-Yen Li:
Realising voice dialogue management in a collaborative virtual environment. 37-44 - Liam Peyton, Jun Hu, Hao Liu, Mansour Alsaleh, Abdulmotaleb El-Saddik:
A collaborative approval process for accessing sensitive data. 45-53 - Francisco J. García-Peñalvo, María N. Moreno García, Jose R. Garcia-Bermejo, Joaquín García:
Collaborative multimedia environment for chess teaching. 54-62 - Ben W. Miners, Otman A. Basir:
Towards understanding expression for tele-operation. 63-70 - Andrew Roczniak, Abdulmotaleb El-Saddik, Pierre Lévy:
INCA: qualitative reference framework for incentive mechanisms in P2P networks. 71-80 - Azzedine Boukerche, Shervin Shirmohammadi, Abuhoss Hossain:
Prediction-based decorators for distributed collaborative haptic virtual environments. 81-88
Volume 29, Number 2/3/4, 2007
- S. L. Ko, Y. M. Baron, J. I. Park:
Effective removal of burrs by magnetic abrasive finishing using face electromagnetic inductor. 90-95 - Yongbo Wu, Masana Kato:
Rounding process of workpiece in through-feed centreless grinding with large grinding allowance. 96-101 - J. H. Liu, Z. J. Pei, G. R. Fisher:
Investigations of silicon wafer grinding using finite element analysis. 102-107 - J. Li, H. Gao, L. Qu, R. Rentsch:
Characterisation of dynamic properties of coating-substrate system by molecular dynamics simulation. 108-113 - X. Wang, J. Y. Zhu, W. Chen, L. Cai:
Influence of micro-patterned laser surface texturing on the tribological performance. 114-119 - X. L. Wang, Y. Wang, Y. N. Xue:
Modelling and analysis of contact force for robotic deburring process. 120-124 - Qilin Deng, Anning Xie, Zhijun Ge, Jianli Song:
Influence of rare-earth La. 125-129 - F. Jiao, X. S. Zhu, B. Zhao, C. S. Liu, G. F. Gao:
Optimum design and grinding performance of ultrasonic hone-lapping tool with fixed abrasive material. 130-136 - D. W. Jia, A. B. Yu, X. F. Zhang, Y. Chen:
Identification and measurement of superabrasive shapes. 137-140 - H. W. Sun, S. C. Yang:
Study on the finishing mechanism of fluid magnetic abrasive. 141-144 - Y. Dai:
Surface finishing of new type RS-SiC ceramics. 145-149 - H. Huang, Y. B. Guo, Z. Z. Wang:
Research on aspheric machining system error compensation and experiment eliminate the error wave area. 150-154 - Fuqing Liu, Wei Peng, Chunyan Yao:
Research on the properties of ultraviolet-curing resin lapping plate. 155-158 - Quantang Fan, Jianqiang Zhu, Baoan Zhang, Lei Bao:
Motion simulation of annular polishing. 159-162 - S. C. Xiu, G. Q. Cai, C. H. Li:
Study on surface finish mechanism in quick-point grinding. 163-167 - W. H. Li, S. Q. Yang, S. C. Yang:
Technique and theoretical analysis for the finishing of large discal parts. 168-172 - Y. C. Zhang, Y. F. Wu, S. G. Ma, S. N. Sun, Y. Zhou, M. Geng:
Preparation and performance study of TiN films deposited by MF unbalanced magnetron sputtering technique. 173-177 - D. G. Xie, B. Gao, Y. X. Yao, Z. J. Yuan:
Investigation of the material removal model for bonnet tool polishing with precession. 178-181 - J. Xie, Z. W. Ruan, Junichi Tamaki:
An experimental study on mirror-form grinding of free-form surface by the use of coarse diamond grinding wheel. 182-186 - Z. J. Hou, P. Q. Ge, Y. F. Gao:
The development of a wire saw for wafer slicing of single-crystal silicon. 187-190 - Miao Yu, Ji Zhao:
A study of the inverse dynamics of a hybrid polishing kinematical machine tool based on the flexible multi-body systems. 191-194 - Y. W. Sun, L. H. Meng, D. M. Guo, Z. Y. Jia:
Development of a global-local geometric planning approach to automated part finishing processes. 195-199 - T. B. Yu, Y. Lu, X. L. Yang, W. S. Wang:
Study on application of squeeze oil film technology in deep hole surface finishing. 200-204 - S. Q. Yang, W. H. Li, S. C. Yang:
Numerical simulation of compulsive swirling flows field on two-phase swirling flows finishing. 205-207 - J. F. Meng, P. Q. Ge, J. F. Li:
The surface quality of monocrystalline silicon cutting using fixed abrasive diamond endless wire saw. 208-211 - S. M. Ji, L. Zhang, Q. L. Yuan, M. S. Jin, J. L. Yuan:
A novel ballonet polishing tool and its robot control system for polishing the curved surface of mould. 212-215 - X. J. Zhu, Y. X. Gao, H. J. Xu:
A new ultrasonic vibration machine for honing. 216-219 - Y. P. Ma, M. Chen, D. H. Xiang, F. H. Sun:
Fabrication and characterisation of ultra fine-grained diamond coatings on the interior hole surface. 220-224 - Y. G. Wang, F. L. Zhao, H. Wang:
A study on the effect of powder on surface quality in EDM finishing. 225-228 - J. Y. Shen, W. Lin, H. Ohmori, X. P. Xu:
Evaluation of surface roughness for ELID ground brittle materials. 229-233 - B. X. Jia, W. F. Bian, Z. L. Wang, W. S. Zhao:
Study on the topography of the surfaces machined by micro-EDM. 234-238 - G. C. Wang, C. Y. Zhang, Y. M. Zhu, H. J. Pei, W. G. Wu, Q. F. Li:
Formation and control of burrs in precision machining. 239-242 - C. Z. Ren, W. D. Jin:
State control of passivating films in electrolytic in-process dressing precision grinding for silicon nitride. 243-246 - Z. Z. Zhou, J. J. Zheng, J. L. Yuan, B. H. Lv, Z. W. Wang:
Simulation of a ceramic ball lapping process under dual rotating plates lapping mode. 247-251 - F. H. Zhang, H. J. Wang, D. R. Luan:
Research on machining mechanics and experiment of ultrasonic-magnetorheological compound finishing. 252-256 - Ji Zhao, Z. Q. Cao, J. M. Zhan, F. Zhang, L. Niu:
Research on hydrodynamic suspension nanoscale polishing for K9 optical glass. 257-261 - C. H. Li, G. Q. Cai, S. C. Xiu:
Auto-correlation study on the surface profile finished by abrasive jet with grinding wheel as restraint. 262-265
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