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Karlheinz Bock
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2020 – today
- 2023
- [c8]Viktor Dudash, Kashi Vishwanath Machani, Bjoern Boehme, Simone Capecchi, Jungtae Ok, Karsten Meier, Frank Kuechenmeister, Marcel Wieland, Karlheinz Bock:
Wafer Level Chip Scale Package Failure Mode Prediction using Finite Element Modeling. IRPS 2023: 1-6 - [c7]Marco Liess, Julian Demicoli, Tobias Tiedje, Matthias Lohrmann, Matthias Nickel, M. Luniak, Dimitrios A. Prousalis
, Thomas Wild, Ronald Tetzlaff
, Diana Göhringer, Christian Mayr, Karlheinz Bock, Sebastian Steinhorst, Andreas Herkersdorf:
X-MAPE: Extending 6G-Connected Self-Adaptive Systems with Reflexive Actions. NFV-SDN 2023: 163-167
2010 – 2019
- 2019
- [j7]Gerhard P. Fettweis
, Meik Dorpinghaus
, Jerónimo Castrillón
, Akash Kumar
, Christel Baier
, Karlheinz Bock, Frank Ellinger, Andreas Fery, Frank H. P. Fitzek
, Hermann Härtig, Kambiz Jamshidi
, Thomas Kissinger
, Wolfgang Lehner
, Michael Mertig
, Wolfgang E. Nagel, Giang T. Nguyen
, Dirk Plettemeier, Michael Schröter, Thorsten Strufe:
Architecture and Advanced Electronics Pathways Toward Highly Adaptive Energy- Efficient Computing. Proc. IEEE 107(1): 204-231 (2019) - 2018
- [j6]Krzysztof Nieweglowski, Lukas Lorenz, Sebastian Lüngen, Tobias Tiedje, Klaus-Jürgen Wolter, Karlheinz Bock:
Optical coupling with flexible polymer waveguides for chip-to-chip interconnects in electronic systems. Microelectron. Reliab. 84: 121-126 (2018) - [j5]Karsten M. Decker, René M. Rehmann, Mike Roellig, Karlheinz Bock:
Fatigue measurement setup under combined thermal and vibration loading on electronic SMT assembly. Microelectron. Reliab. 87: 125-132 (2018) - [c6]Christian Maleck, Gottfried Nieke, Karlheinz Bock, Detlef Pabst, Marcel Stehli:
A Comparison of an CP and MIP Approach for Scheduling jobs in production areas with Time Constraints and uncertainties. WSC 2018: 3526-3537 - [c5]Gottfried Nieke, Christian Maleck, Karlheinz Bock, Marcel Stehli, Steffen Kalisch:
A Mathematical Model for the External Scheduling of a Cluster Tool Workstation. WSC 2018: 3538-3549 - [c4]Dirk Doleschal, Karlheinz Bock:
A CP Model for a Scheduling Problem with Limited secondary Resources compared to a des Model. WSC 2018: 3684-3695 - 2017
- [c3]Mircea Catuneanu, Ronny Henker, R. Hosseini, M. Jazayerifar, H. Aminpour, David Schoeniger, Alexandru Giuglea, Krzysztof Nieweglowski, Frank Ellinger, Karlheinz Bock, Kambiz Jamshidi:
Design considerations and constraints in silicon based optical on-board interconnects for short range communications. ICTON 2017: 1-4 - 2015
- [c2]Tetiana Voitsekhivska
, Felix Zorgiebel, Eike Suthau, Klaus-Jürgen Wolter, Karlheinz Bock, Gianaurelio Cuniberti
:
pH measurements of FET-based (bio)chemical sensors using portable measurement system. EMBC 2015: 6445-6448 - [c1]Michael Jenning, Bernhard Klein, Ronny Hahnel, Dirk Plettemeier, David Fritsche, Gregor Tretter, Corrado Carta
, Frank Ellinger, Tobias Nardmann, Michael Schröter, Krzysztof Nieweglowski, Karlheinz Bock, Johannes Israel, Andreas Fischer
, Najeeb ul Hassan, Lukas Landau
, Meik Dorpinghaus, Gerhard P. Fettweis:
Energy-Efficient Transceivers for Ultra-Highspeed Computer Board-to-Board Communication. ICUWB 2015: 1-5 - 2014
- [j4]Indranil Bose, Kornelius Tetzner
, Kathrin Borner, Karlheinz Bock:
Air-stable, high current density, solution-processable, amorphous organic rectifying diodes (ORDs) for low-cost fabrication of flexible passive low frequency RFID tags. Microelectron. Reliab. 54(9-10): 1643-1647 (2014)
2000 – 2009
- 2007
- [j3]Stephan Schoenfelder
, Matthias Ebert, Christof Landesberger, Karlheinz Bock, Jörg Bagdahn
:
Investigations of the influence of dicing techniques on the strength properties of thin silicon. Microelectron. Reliab. 47(2-3): 168-178 (2007) - [p1]Karlheinz Bock:
Polytronik und das Internet der Dinge. Internet der Dinge 2007: 203-218 - 2005
- [j2]Karlheinz Bock:
Polymer Electronics Systems - Polytronics. Proc. IEEE 93(8): 1400-1406 (2005) - 2001
- [j1]Karlheinz Bock, Bart Keppens, Vincent De Heyn, Guido Groeseneken
, L. Y. Ching, A. Naem:
Influence of gate length on ESD-performance for deep submicron CMOS technology. Microelectron. Reliab. 41(3): 375-383 (2001)
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last updated on 2024-08-05 21:22 CEST by the dblp team
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