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ORCIDMauro J. Kobrinsky
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2020 – today
- 2023
[c5]Mauro J. Kobrinsky, J. D. Silva, E. Mannebach, S. Mills, M. Abd El Qader, O. Adebayo, N. Arkali Radhakrishna, M. Beasley, J. Chawla, S. Chugh, A. Dasgupta, U. Desai, E. De Re, G. Dewey, T. Edwards, C. Engel, V. Gudmundsson, Jeffery Hicks, B. Krist, R. Mehandru, Inanc Meric, Patrick Morrow, D. Nandi, P. Patel, R. Ramamurthy, D. Samanta, L. Shoer, A. St Amour, L. H. Tan, Sukru Yemenicioglu, X. Wang, T. Ghani:
Novel Cell Architectures with Back-side Transistor Contacts for Scaling and Performance. VLSI Technology and Circuits 2023: 1-2- [c4]C. H. Naylor, Kirby Maxey, C. Jezewski, K. P. O'Brien, A. V. Penumatcha, M. S. Kavrik, B. Agrawal, C. V. Littlefield, J. Lux, B. Barley, Justin R. Weber, A. Sen Gupta, C. J. Dorow, N. Arefin, S. King, R. Chebiam, J. Plombon, S. B. Clendenning, U. E. Avci, Mauro J. Kobrinsky, M. Metz:
2D Materials in the BEOL. VLSI Technology and Circuits 2023: 1-2 - 2021
- [c3]Mauro J. Kobrinsky, Rahim Kasim:
Back End Of Line opportunities and reliability challenges for future technology nodes. IRPS 2021: 1-2
2010 – 2019
- 2015
- [c2]D. Slottke, R. J. Kamaladasa, M. Harmes, Ilan Tsameret, Mauro J. Kobrinsky, Timothy McMullen, John Dunklee:
Wafer-level electromigration for reliability monitoring: Quick-turn electromigration stress with correlation to package-level stress. IRPS 2015: 3 - 2014
- [c1]Ricky Tseng, James O'Callaghan, Feras Eid, Michael Gleeson, Brandon Rawlings, Mauro J. Kobrinsky, Ibrahim Ban, Roger Nagle, William McFarlane, Brian Corbett
, Peter Chang:
Laser integration with CMOS assembly process for Si photonics. OFC 2014: 1-3
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