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C. C. Lee
This is just a disambiguation page, and is not intended to be the bibliography of an actual person. The links to all actual bibliographies of persons of the same or a similar name can be found below. Any publication listed on this page has not been assigned to an actual author yet. If you know the true author of one of the publications listed below, you are welcome to contact us.
Person information
Other persons with the same name
- Chung-Chieh Lee (aka: C. C. Lee 0001, C.-C. Lee 0001) — Northwestern University, Evanston, IL, USA
- Chi Chung Lee 0001 (aka: Tony Chi Chung Lee, C. C. Lee 0002) — Hong Kong Metropolitan University (and 1 more)
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2020 – today
- 2024
- [c7]W. F. Tang, C. H. Li, S. L. Mak, C. C. Lee, T. H. Chan, K. N. Mak, C. L. Won:
Development of Sand-Free Plastering Smart Robotic System for Green Building. ICIT 2024: 1-9 - 2023
- [c6]Y. H. Lin, C. C. Lee, C. Y. Liao, M. H. Lin, W. C. Tu, Robin Chen, H. P. Chen, Winston S. Shue, Min Cao:
A Novel Methodology to Predict Process-Induced Warpage in Advanced BEOL Interconnects. IRPS 2023: 1-4
2010 – 2019
- 2016
- [j6]C. T. Lee, C. C. Lee:
Symbolic computation on a second-order KdV equation. J. Symb. Comput. 74: 70-95 (2016) - 2013
- [j5]C.-W. Chung, C.-C. Lee, C.-C. Liu:
Investigating face-to-face peer interaction patterns in a collaborative Web discovery task: the benefits of a shared display. J. Comput. Assist. Learn. 29(2): 188-206 (2013) - [c5]S.-S. Lin, C.-L. Kao, Jiun-Lang Huang, C.-C. Lee, Xuan-Lun Huang:
An IDDQ-based source driver IC design-for-test technique. ICCAD 2013: 393-398 - 2011
- [j4]T. Y. Hung, S. Y. Chiang, C. J. Huang, C. C. Lee, Kuo-Ning Chiang:
Thermal-mechanical behavior of the bonding wire for a power module subjected to the power cycling test. Microelectron. Reliab. 51(9-11): 1819-1823 (2011) - [c4]W.-A. Lin, C.-C. Lee, J.-L. Huang:
Sigma-delta modulation based wafer-level testing for TFT-LCD source driver ICs. VTS 2011: 315-320
2000 – 2009
- 2007
- [j3]C. C. Chiu, H. H. Chang, C. C. Lee, C. C. Hsia, Kuo-Ning Chiang:
Reliability of interfacial adhesion in a multi-level copper/low-k interconnect structure. Microelectron. Reliab. 47(9-11): 1506-1511 (2007) - 2006
- [j2]Robin C. J. Wang, C. C. Lee, L. D. Chen, Kenneth Wu, K. S. Chang-Liao:
A study of Cu/Low-k stress-induced voiding at via bottom and its microstructure effect. Microelectron. Reliab. 46(9-11): 1673-1678 (2006)
1990 – 1999
- 1994
- [c3]Eddie Jennings, R. D. Holland, C. C. Lee:
Error analysis of look-up-table implementations in device-independent color imaging systems. Device-Independent Color Imaging 1994: 98-107 - [c2]Hamid Jafarkhani, Nariman Farvardin, C.-C. Lee:
Adaptive Image Coding Based on the Discrete Wavelet Transform. ICIP (3) 1994: 343-347 - 1993
- [c1]Nariman Farvardin, Xiaonong Ran, C.-C. Lee:
Adaptive DCT coding of images using entropy-constrained trellis coded quantization. ICASSP (5) 1993: 397-400
1980 – 1989
- 1988
- [j1]L. Y. Wei, J. P. Lee, C. C. Lee:
Recognition of Chinese diphones. IEEE Trans. Acoust. Speech Signal Process. 36(10): 1684-1687 (1988)
Coauthor Index
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