"Cooling from the bottom side (laminate (substrate) side) of a ..."

Keiji Matsumoto, Hiroyuki Mori, Yasumitsu Orii (2014)

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DOI: 10.1109/3DIC.2014.7152164

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-21

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Keiji Matsumoto, Hiroyuki Mori, Yasumitsu Orii:
Cooling from the bottom side (laminate (substrate) side) of a three-dimensional (3D) chip stack. 3DIC 2014: 1-6

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