"Low-loss shielded through-silicon vias filled with multi-walled carbon ..."

Jinrong Su et al. (2016)

> Home

Details and statistics

DOI: 10.1016/J.MEJO.2016.11.003

access: closed

type: Journal Article

metadata version: 2020-02-22

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/mj/SuMCHYZ16
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mj/SuMCHYZ16
Jinrong Su, Runbo Ma, Xinwei Chen, Liping Han, Rongcao Yang, Wenmei Zhang:
Low-loss shielded through-silicon vias filled with multi-walled carbon nanotube bundle. Microelectron. J. 58: 83-88 (2016)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.