"Bump formation for flip chip and CSP by solder paste printing."

Joachim Kloeser et al. (2002)

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DOI: 10.1016/S0026-2714(01)00223-2

access: closed

type: Journal Article

metadata version: 2020-02-22

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Joachim Kloeser, Paradiso Coskina, Rolf Aschenbrenner, Herbert Reichl:
Bump formation for flip chip and CSP by solder paste printing. Microelectron. Reliab. 42(3): 391-398 (2002)

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