Dr. Markus Schulz

It is all about #MEMORY , for me and for MEMPHIS Electronic - We care for our customers engineers , and purchasers to provide the best fit for their product designs for more than 33 YEARS 🦖 - Please vote for us 🙏 #appreciation What’s the name of the only MEMORY COMPETENCE CENTER and best specialty distributor in the world? If you ask me - it is MEMPHIS Electronic, quite obviously. If you agree, then cast your vote for us in the reader’s choice award of the publication Elektronik: https://bit.ly/3Hw7B5c (1 is the best grade 🙏) - Thank you ver much 😉 Not quite convinced? Then put us to the test! Here’s a quick overview of why we are more than just a distributor: https://bit.ly/3QtIILE We are just a phone call, DM or an email away. #semiconductorindustry #semiconductors #semiconductor #technology #ai #tech #dram #nand #nandflash #flashmemory #chip #chips #ssd #ssds #distribution #memorycompetencecenter #embeddedsystems #computer Intelligent Memory Neumonda

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CALL THIS WEEK FOR EUROPEAN CHIPS ACT 2.0. WHAT?? I am looking forward to chairing a very topical panel at the Optica GLOBAL PHOTONICS ECONOMIC FORUM in Malaga on Day One (Oct 1st). I will be quizzing the following specialists. Gregg Bartlett, CTO, GlobalFoundries;  Burkhard Slischka, Co-founder & CEO, ALLOS Semiconductors;  Ed Bailey, GM/VP, Jabil;  Martin Schell, Executive Director, Fraunhofer Heinrich Hertz Institute HHI; Torsten Vahrenkamp, CEO, ficonTEC; M. Ashkan Seyedi, Principal, NVIDIA. I expect this week’s story to come up. ESIA Calls for a Chips Act 2.0 The European Semiconductor Industry Association (ESIA), representing major players like NXP Semiconductors, Infineon Technologies, imec, and Fraunhofer, is urging the European Union to fast-track a second phase of its semiconductor strategy through a "Chips Act 2.0." The goal? To keep the region competitive in the fast-moving global race for semiconductor dominance. The original EU Chips Act, which became law in September 2023, seeks to mobilize €43 billion in public and private investment to strengthen Europe’s semiconductor capabilities, targeting 20% of the global market share by 2030. However, in a statement released Monday, ESIA warned that Europe must do more. While acknowledging the significance of the Chips Act as a "fundamental building block," the group emphasized the need to refine the scope, streamline funding processes, and fill existing gaps. Accelerating State Aid for Global Attractiveness One of the critical mechanisms under the Chips Act is providing state aid to attract global semiconductor manufacturers. Yet, delays in approval are hampering progress. For example, Intel’s proposed €30 billion mega-fab in Germany is still awaiting final approval. By contrast, Taiwan’s TSMC received €5 billion in support from the EU for its new chip facility in Dresden, but this came a year after the company’s commitment to invest in the bloc. ESIA advocates for the EU to fast-track these funding approvals to ensure Europe remains an attractive destination for chipmakers. Open Trade and Strategic Cooperation Beyond funding, ESIA calls for a more open trade policy to maintain global partnerships. They argue for a proactive approach to economic security rather than relying on protectionist measures. The Dutch government, under pressure from the US, has now announced further limits on the export of chipmaking machinery to China. The machines in question are ASML's 1970i and 1980i DUV (Deep Ultraviolet) immersion lithography tools. Toward a Coordinated Industrial Strategy Finally, ESIA recommends a coordinated, long-term industrial strategy led by a "Chips Envoy," an official tasked with aligning Europe’s semiconductor (and photonics?) goals across multiple industries. For the photonics industry, staying close to these developments is essential. Curious on the details?: read the attached document. Credit to Ioanna Lykiardopoulou of TNW for spotting this development.

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#Microchip's new family of radiation tolerant (#RT) #LE50-28 isolated DC-DC 50W #powerconverters, available in nine models with single and triple outputs from 3.3V to 28V. The off-the-shelf LE50-28 series power converters are designed to meet MIL-STD-461 standards. The series has the flexibility to parallel up to four power converters to achieve 200 watts of power. Designed to serve 28V bus systems, the LE50-28 isolated DC-DC power converters can be integrated with Microchip's #PolarFire #FPGAs, #microcontrollers, and #LX7720-RT #motorcontrolsensors for a complete #electricalsystem solution. The LE50-28 power converters offer a variety of electrical connection and mounting options. The #LE50 series is manufactured using traditional #surfacemount and through-hole #components on printed wiring boards. The LE50-28 series offers space-grade radiation tolerance, 50 Krad total ionizing dose (#TID), and single particle effect (#SEE) latch-up immunity with 37 MeV-cm2/mg linear energy transfer. #DCDC #LE5028 #electroniccomponents #semiconductor #electronicsproducts #chip #electronics #perceptive #supplychain #oem #ems #odm #electric #electronics #purchasing #chips #shortage #microchip #altera #adi #xilink #ti

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Doulos' webinar shares how to debug UVM with Cadence.

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Great OFC coverage by LightCounting. TeraSignal’s Intelligent Re-Driver in CMOS is changing the power, reliability and performance calculus between DSP and LPO modules.

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This month's safety matters #EZBlog series is about the requirement for on chip separation to allow a claim of HFT=1. So, if you are looking for a blog on IEC 61508-2:2010 Annex E, this is for you!

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