Location via proxy:   [ UP ]  
[Report a bug]   [Manage cookies]                
  • Jang H, Lee S, Park H and Lee W. Development of a Low-Power Touch-Based Lifelogging Processor. IEEE Transactions on Circuits and Systems II: Express Briefs. 10.1109/TCSII.2024.3368410. 71:8. (3910-3914).

    https://ieeexplore.ieee.org/document/10443670/

  • Chakraborty S, Sharma Y and Moulik S. (2024). TREAFET: Temperature-Aware Real-Time Task Scheduling for FinFET based Multicores. ACM Transactions on Embedded Computing Systems. 10.1145/3665276.

    https://dl.acm.org/doi/10.1145/3665276

  • Chen X and Yang Q. (2022). Speed and Power Tradeoff Based on FinFET Structure, Voltage Changing and Circuit Layout 2022 IEEE 5th International Conference on Automation, Electronics and Electrical Engineering (AUTEEE). 10.1109/AUTEEE56487.2022.9994548. 978-1-6654-7197-8. (465-470).

    https://ieeexplore.ieee.org/document/9994548/

  • Feng L, Huang J, Li L, Zhang H and Wang Z. (2022). <sc>RvDfi</sc>: A RISC-V Architecture With Security Enforcement by High Performance Complete Data-Flow Integrity. IEEE Transactions on Computers. 71:10. (2499-2512). Online publication date: 1-Oct-2022.

    https://doi.org/10.1109/TC.2021.3133701

  • Lee K, Park J, Choi E, Jeon M and Lee W. (2022). Developing a TEI-Aware PMIC for Ultra-Low-Power System-on-Chips. Energies. 10.3390/en15186780. 15:18. (6780).

    https://www.mdpi.com/1996-1073/15/18/6780

  • Li W, Shi J, Li F, Lin J, Wang W and Guan L. μAFL. Proceedings of the 44th International Conference on Software Engineering. (1-12).

    https://doi.org/10.1145/3510003.3510208

  • Lee S, Lee J, Lee J and Lee W. (2021). TEI-DTA: Optimizing a Vehicular Sensor Network Operating with Ultra-Low Power System-on-Chips. Electronics. 10.3390/electronics10151789. 10:15. (1789).

    https://www.mdpi.com/2079-9292/10/15/1789

  • Han K, Lee S, Oh K, Bae Y, Jang H, Lee J, Lee W and Pedram M. Developing TEI-Aware Ultralow-Power SoC Platforms for IoT End Nodes. IEEE Internet of Things Journal. 10.1109/JIOT.2020.3027479. 8:6. (4642-4656).

    https://ieeexplore.ieee.org/document/9208740/

  • Hossain M and Savidis I. (2020). Dynamic differential signaling based logic families for robust ultra-low power near-threshold computing. Microelectronics Journal. 10.1016/j.mejo.2020.104801. 102. (104801). Online publication date: 1-Aug-2020.

    https://linkinghub.elsevier.com/retrieve/pii/S0026269220300124

  • Hwang W, Yoo K, Thai D, Lee W and Baek K. (2020). Design of a DC–DC Converter Customized for Ultra-Low Voltage Operating IoT Platforms. Energies. 10.3390/en13020461. 13:2. (461).

    https://www.mdpi.com/1996-1073/13/2/461

  • Lee W, Kang T, Lee J, Han K, Kim J and Pedram M. (2019). TEI-ULP: Exploiting Body Biasing to Improve the TEI-Aware Ultralow Power Methods. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. 38:9. (1758-1770). Online publication date: 1-Sep-2019.

    https://doi.org/10.1109/TCAD.2018.2859240

  • Han K, Lee S, Lee J, Lee W and Pedram M. (2019). TIP: A Temperature Effect Inversion-Aware Ultra-Low Power System-on-Chip Platform 2019 IEEE/ACM International Symposium on Low Power Electronics and Design (ISLPED). 10.1109/ISLPED.2019.8824925. 978-1-7281-2954-9. (1-6).

    https://ieeexplore.ieee.org/document/8824925/

  • Zhang Y, Zhang X and Bakir M. Benchmarking Digital Die-to-Die Channels in 2.5-D and 3-D Heterogeneous Integration Platforms. IEEE Transactions on Electron Devices. 10.1109/TED.2018.2876688. 65:12. (5460-5467).

    https://ieeexplore.ieee.org/document/8525345/