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- articleOctober 2012
A fuzzy ANP model for supplier selection as applied to IC packaging
Journal of Intelligent Manufacturing (SPJIM), Volume 23, Issue 5October 2012, Pages 1477–1488https://doi.org/10.1007/s10845-010-0448-6Supplier selection has been a popular topic since the selection of the most appropriate supplier for cooperation is being increasingly important for the success of an enterprise. The problem is multi-criteria in nature, and a variety of multi-criteria ...
- articleDecember 2010
Application of dynamic diffusion theory in foreign direct investment of Taiwan IC industry in China
International Journal of Computational Science and Engineering (IJCSE), Volume 5, Issue 1December 2010, Pages 2–9https://doi.org/10.1504/IJCSE.2010.030225This study applies dynamic diffusion theory to forecast Foreign Direct Investments (FDIs) of Taiwan IC industry into China. We compare the FDI external and internal influence factors among IC design, packaging and testing industries. The internal impact ...
- articleApril 2010
A Study of Applying RFID for Heat Block Management in IC Packaging Factory
International Journal of Advanced Pervasive and Ubiquitous Computing (IJAPUC-IGI), Volume 2, Issue 2April 2010, Pages 57–68https://doi.org/10.4018/japuc.2010040104In the integrated circuit IC packaging process, including operations of die sawing, die bonding, wire bonding, molding, plating, marking, trim/form, and inspection. Purposes of packaging include protecting ICs, making ICs easier to handle, and ...
- articleJanuary 2009
Application of a combined methodology for extraction of the electrical model of a lead frame chip-scale package
Microelectronics Journal (MICROJ), Volume 40, Issue 1January, 2009, Pages 185–192https://doi.org/10.1016/j.mejo.2008.07.004An ultra-miniature interconnect (IC) package such as a chip-scale package (CSP) provides a difficult challenge in electrical model extraction, particularly to multi-GHz frequencies, because the very small parasitics can easily be swamped by test fixture ...
- articleAugust 2007
Visualization of machine clustering for a Taiwanese IC packaging foundry
Expert Systems with Applications: An International Journal (EXWA), Volume 33, Issue 2August, 2007, Pages 324–329https://doi.org/10.1016/j.eswa.2006.05.009This paper applies a two-phase methodology to cluster 366 records of the wire bond machines for a Taiwanese IC packaging foundry, where six attributes of each machine are chosen to cluster. The purpose of clustering in this paper is to help the foundry ...
- ArticleJuly 2006
Entering the hot zone: can you handle the heat and be cool?
DAC '06: Proceedings of the 43rd annual Design Automation ConferenceJuly 2006, Pages 174–175https://doi.org/10.1145/1146909.1146957With the latest gaming systems such as X-box, Playstation 3, PSP, IPTV, and H264 requiring more bandwidth, packaged in smaller devices, and providing higher quality, in return they evacuate more heat and consume more power, thus making power consumption ...