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2 Results for: Book/Issue: ISPD '23: Proceedings of the 2023 International Symposium on Physical Design
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- research-articleMarch 2023
Recent Progress in the Analysis of Electromigration and Stress Migration in Large Multisegment Interconnects
- Nestor Evmorfopoulos,
- Mohammad Abdullah Al Shohel,
- Olympia Axelou,
- Pavlos Stoikos,
- Vidya A. Chhabria,
- Sachin S. Sapatnekar
ISPD '23: Proceedings of the 2023 International Symposium on Physical DesignPages 115–123https://doi.org/10.1145/3569052.3578919Traditional approaches to analyzing electromigration (EM) in on-chip interconnects are largely driven by semi-empirical models. However, such methods are inexact for the typical multisegment lines that are found in modern integrated circuits. This paper ...
- research-articleMarch 2023
Combined Modeling of Electromigration, Thermal and Stress Migration in AC Interconnect Lines
ISPD '23: Proceedings of the 2023 International Symposium on Physical DesignPages 107–114https://doi.org/10.1145/3569052.3571880The migration of atoms in metal interconnects in integrated circuits (ICs) increasingly endangers chip reliability. The susceptibility of DC interconnects to electromigration has been extensively studied. A few works on thermal migration and AC ...
