Abstract
A new assembly method for silicon micro-parts with non-planar steel parts is proposed: low-temperature soldering. Existing techniques for micro-mechanical assemblies are analyzed and compared to the proposed method, the method is explained and validated on an existing product using functional tests. Performances of the reference method (adhesive bonding) are not yet fully reached, but the results are close and partially fulfil the specifications of the current production.
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Notter, L., Jacot, J. (2014). Assembly of Silicon Micro-parts with Steel Spindles Using Low-Temperature Soldering. In: Ratchev, S. (eds) Precision Assembly Technologies and Systems. IPAS 2014. IFIP Advances in Information and Communication Technology, vol 435. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-662-45586-9_2
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DOI: https://doi.org/10.1007/978-3-662-45586-9_2
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-662-45585-2
Online ISBN: 978-3-662-45586-9
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