Abstractf
The implementation of passive rf functions is usually done by means of coplanar waveguides at mm-wave frequencies. We propose original solutions for improving their reliability, by integrating the parasitic mode filters as dielectric bridges through a 3D integration approach. Furthermore, original compensating methods are proposed in order to control the cut-off frequencies induced by the bounding networks.
The 3D hybrid approach can also be efficiently used so as to accommodate the association between active, passive and radiating components. The 3D-CPW technology is therefore completed with Thin Film MicroStrip configurations (tfms), while composite ceramic/foam architectures become thinkable for radiating arrays.
Résumé
Le développement de fonctions passives radiofréquences est généralement effectué par ľ intermédiaire de guides coplanaires aux longueurs ď onde millimétriques. Nous proposons des solutions originales pour améliorer leur fiabilité, par ľ intégration de filtres de modes parasites sous forme de ponts diélectriques intégrés multicouches. Des methodes de compensation originales sont proposées afin de maîtriser les fréquences de coupure induites par ces réseaux de ponts diélectriques.
Ľ approche hybride 3D proposée peut également être mise à profit pour optimiser ľ interaction entre composants actifs, passifs et rayonnants. La technologie coplanaire 3D est ainsi complétée par des configurations de type microruban sur substrat mince (tfms), tandis que des architectures composites ceramique/mousse deviennent envisageables pour integrer les antennes en réseau.
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Person, C., Rius, E. & Coupez, J. Hybrid 3d integrated circuits at millimeter-wave frequencies — advantages and trends. Ann. Télécommun. 56, 39–50 (2001). https://doi.org/10.1007/BF03002984
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DOI: https://doi.org/10.1007/BF03002984
Key words
- Microwave integrated circuit
- Hybrid integrated circuit
- Millimetric wave
- Three-dimensional integration
- Coplanar technology
- Microstrip line
- Antenna array
- Patch antenna
- Dielectric substrate
- Multilayered structure