Abstract
This paper presents multiwave interconnections — optical interconnections that employ wavelength components as multiplexable information carriers — for next-generation multiprocessor systems using MCM technology. A hypercube-based multiprocessor network called the multiwave hypercube (MWHC) is introduced, where multiwave interconnections provide highly-flexible dynamic communication channels. A performance analysis shows that the use of integrated multiwave optics enables the reduction of network complexity on a MCM substrate, while supporting low-latency message routing.
In this paper, we also present the experimental fabrication of wavelength detectors for the proposed system, and discuss the physical limit on the number of wavelength components at the present state of technology.
Chapter PDF
Keywords
References
P. R. Mukund and J. F. McDonald, “MCM: The high-performance electronic packaging technology”, IEEE Computer, Vol. 26, No. 4, pp. 10–12, April 1993.
R. K. Scannell and J. K. Hagge, “Development of a multichip module DSP,” IEEE Computer, Vol. 26, No. 4, pp. 13–21, April 1993.
P. W. Dowd, “Wavelength division multiple access channel hypercube processor interconnection,” IEEE Trans. Computers, Vol. 41, No. 10, pp. 1223–1241, October 1992.
K. Ghose, R. K. Horsell, and Singhvi N. K., “Hybrid multiprocessing using WDM optical fiber interconnections,” Proc. 1st Int'l Workshop on Massively Parallel Processing using Optical Interconnections, pp. 182–196, April 1994.
T. Takimoto, T. Aoki, and T. Higuchi, “Design of multiplex interconnection networks for massively parallel computing systems,” Proc. 24th IEEE Int'l Symp. Multiple-Valued Logic, pp. 231–238, May 1994.
R. Selvaraj, H. T. Lin, and J. F. McDonald, “Integrated optical waveguides in polyimide for wafer scale integration,” IEEE J. Lightwave Technol., Vol. 6, No. 6, pp. 1034–1044, June 1988.
C. J. Chang-Hasnain, J. P. Harbison, C. Zah, M. W. Maeda, L. T. Florez, N. G. Stoffel, and T. Lee,“Multiple wavelength tunable surface-emitting laser arrays,” IEEE J. Quantum Electron., Vol. 27, No. 6, pp. 1368–1376, June 1991.
T. Aoki, Y. Watanabe, T. Higuchi, S. Kawahito, and Y. Tadokoro, “Multiwave computing circuits using integrated opto-electronic devices,” ISSCC Digest of Technical Papers, pp. 134–135, February 1994.
W. Daum, W. E. Burdick Jr, and R. A. Fillion, “Overlay high-density interconnect: A chips-first multichip module technology,” IEEE Computer, Vol. 26, No. 4, pp. 23–29, April 1993.
A. Iwata and I. Hayashi, “Optical interconnections as a new LSI technology,” IEICE Trans. Electron., Vol. E76-C, No. 1, pp. 90–99, January 1993.
L. N. Bhuyan and D. P. Agrawal, “Generalized hypercube and hyperbus structures for a computer network,” IEEE Trans. Computers, Vol. 33, No. 4, pp. 323–333, April 1984.
W. J. Dally, “Performance analysis of k-ary n-cube interconnection networks,” IEEE Trans. Computers, Vol. 39, No. 6, pp. 775–785, June 1990.
J. Minowa and Y. Fujii, “Dielectric multilayer thin-film filter for WDM transmission systems,” IEEE J. Lightwave Technol, Vol. 1, No. 1, pp. 116–121, March 1983.
I. Hayashi, “Optoelectronic devices and material technologies for photo-electronic integrated systems,” Jpn. J. Appl. Phys., Vol. 32, No. 1B, pp. 266–271, January 1993.
Author information
Authors and Affiliations
Editor information
Rights and permissions
Copyright information
© 1995 Springer-Verlag Berlin Heidelberg
About this paper
Cite this paper
Shionoya, S., Aoki, T., Higuchi, T. (1995). Multiwave interconnection networks for MCM-based parallel processing. In: Haridi, S., Ali, K., Magnusson, P. (eds) EURO-PAR '95 Parallel Processing. Euro-Par 1995. Lecture Notes in Computer Science, vol 966. Springer, Berlin, Heidelberg. https://doi.org/10.1007/BFb0020495
Download citation
DOI: https://doi.org/10.1007/BFb0020495
Published:
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-540-60247-7
Online ISBN: 978-3-540-44769-6
eBook Packages: Springer Book Archive