Abstract
Data loss has become an inevitable phenomenon in corporate credit risk (CCR) prediction. To ensure the integrity of data information for subsequent analysis and prediction, it is essential to repair the missing data as accurately as possible. To solve the problem of missing data in credit classification, this study proposes a multi-layer perceptron ensemble (MLP–ESM) model that can perform data interpolation and prediction simultaneously to predict CCR. The model makes full use of non-missing information and interpolates more missing columns with fewer missing values. In this way, not only the data features needed for missing data interpolation are extracted, but also the structural relationship features between the predicted target and the existing data are extracted, which can achieve the effect of simultaneous interpolation and prediction. The results show that the MLP–ESM model can effectively interpolate and predict the missing dataset of CCR. The prediction accuracy is 83.11%, which is better than the traditional machine learning model. This fully shows that the dataset after interpolation can achieve a better prediction effect.
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The datasets generated during and/or analyzed during the current study are not publicly available due to data being private but are available from the corresponding author on reasonable request.
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Funding
This work was supported by the graduate research and innovation foundation of Chongqing, China [Grant No. CYS21047] and 2022 Scientific Research Startup Fund of Chongqing Jiaotong University [Grant No. F1210045].
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MY: Conceptualization, Investigation, Writing—original draft, Validation, Visualization. MKL: Conceptualization, Project administration, Validation. YQ: Validation, Visualization. XL: Conceptualization, Investigation, Validation. DN: Conceptualization, Methodology, Project administration.
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Yang, M., Lim, M.K., Qu, Y. et al. Repair missing data to improve corporate credit risk prediction accuracy with multi-layer perceptron. Soft Comput 26, 9167–9178 (2022). https://doi.org/10.1007/s00500-022-07277-4
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DOI: https://doi.org/10.1007/s00500-022-07277-4