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Fabrication and Characterization of Aluminum SQUID Transmission Lines

Luca Planat, Ekaterina Al-Tavil, Javier Puertas Martínez, Rémy Dassonneville, Farshad Foroughi, Sébastien Léger, Karthik Bharadwaj, Jovian Delaforce, Vladimir Milchakov, Cécile Naud, Olivier Buisson, Wiebke Hasch-Guichard, and Nicolas Roch
Phys. Rev. Applied 12, 064017 – Published 6 December 2019

Abstract

We report on the fabrication and characterization of flux-tunable, low-loss, superconducting-quantum-interference-device- (SQUID) based transmission lines whose impedance is close to 50Ω. The fabrication process relies on the deposition of a thin dielectric layer (few tens of nanometers) by atomic layer deposition on top of a SQUID array. The whole structure is covered by a nonsuperconducting metallic top-ground plane. We present experimental results from five different samples. We systematically characterize their microscopic parameters by measuring the propagating phase in these structures. We also investigate losses and discriminate conductor losses from dielectric losses. This fabrication method offers several advantages. First, the SQUID-array fabrication relies not on a niobium-trilayer process but on a simpler, double-angle evaporation technique. Second, atomic layer deposition provides a high-quality dielectric, leading to low-loss devices. Furthermore, the SQUID-array fabrication is based on a standard, all-aluminum process, allowing direct integration with superconducting qubits. Moreover, our devices are in situ flux tunable, allowing mitigation of uncertainty inherent in any fabrication process. Finally, because the unit cell is a single SQUID (no extra ground capacitance is needed), it is straightforward to modulate the size of the unit cell periodically, allowing band engineering. This fabrication process can be directly applied to traveling-wave parametric amplifiers.

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  • Received 23 July 2019
  • Revised 6 October 2019

DOI:https://doi.org/10.1103/PhysRevApplied.12.064017

© 2019 American Physical Society

Physics Subject Headings (PhySH)

Condensed Matter, Materials & Applied Physics

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Vol. 12, Iss. 6 — December 2019

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Images

  • Figure 1
    Figure 1

    Fabrication flow for SQUID-based transmission lines and resonators. Step 1, fabrication of long SQUID arrays using electron-beam lithography and double-angle evaporation of aluminum. Step 2, deposition of a conformal alumina layer by ALD. Step 3, evaporation of a thick metallic layer (gold or copper) acting as an electrical ground. This layer is patterned by a combination of electron-beam lithography and lift-off.

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  • Figure 2
    Figure 2

    Samples from the first batch. (a),(b) SQUID-based transmission lines. (c),(d) Resonant structures used as control samples. Every picture is labeled by a number corresponding to the fabrication step as shown in Fig. 1. (a) Input of the SQUID-based transmission line after the first step. The left side shows the bonding pad with a tapered shape, and the right side shows a few dozen SQUIDs. (b) Same structure but after step 3. The gold layer is deposited everywhere but on the bonding pad. SQUIDs are still distinguishable from below the alumina and gold layers. (c) The resonant structure after step 3. The feedline is visible in the middle. On the right side an interdigitated capacitor coupling the feedline to a section of the SQUID-based transmission line (623 unit cells) is shown. (d) Enlargement.

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  • Figure 3
    Figure 3

    Dispersion relations. (a) Dispersion relation of a SQUID-based transmission line (sample B). The black line is a fit of the experimental data to Eq. (2). (b) Dispersion relation of a resonant structure (sample C). Data are acquired by two-tone spectroscopy and fitted with Eq. (2) as well.

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  • Figure 4
    Figure 4

    Calibrated, low-temperature transmission of the STL. Solid lines are experimental data and dashed lines are fits to Eq. (3). Values of the fitting parameters are reported in Table 1. Shaded blue areas represent 5×104 uncertainty on tanδ. Dotted black and dash-dotted gray lines are obtained with Eq. (3) with the same tanδ but with different conductor loss (values indicated in each panel are in the unit of per meter per square root of hertz). All data are taken with input power Pin=106±3dBm except for sample A, where Pin=101±3dBm.

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  • Figure 5
    Figure 5

    Power dependence of losses. For both panels, power is referred to the input of the device. (a) STL calibrated transmission (sample E). Input power and fitted loss tangent are reported directly on the figure. (b) Quality factors (internal and external) of a given resonant mode of sample C (angular frequency ω0=2π×7.47GHz). Fit is obtained for the same resonance at various input powers (see Appendix pp2). Photon number (top axis) is obtained using Eq. (B2).

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  • Figure 6
    Figure 6

    Flux dependence of sample-A transmission. (a) Raw transmission as a function of flux and frequency. (b) Experimental dispersion relation and fits taken at three different magnetic fluxes. (c)–(e) Calibrated transmission. The colors correspond to the same color coding as in (b). The characteristic impedances displayed in the top-right corners are extracted from the fits in (b).

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  • Figure 7
    Figure 7

    Electrical sketches of the two measured structures. (a) Electrical model of the STL. (b) Electrical model of the SQUID-based resonator. The inset shows an SEM picture of three SQUIDs. Highlighted blue regions are Josephson junctions.

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  • Figure 8
    Figure 8

    Transmission S21 of the hanger resonators fitted close to the resonances.

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  • Figure 9
    Figure 9

    Internal quality factors extracted from the fit of 14 modes in sample C between 3.8 and 8.46GHz at input power Pin=136±3dBm, corresponding to the single-photon level. We observe a spread of the internal quality factor of around 200 at this power.

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  • Figure 10
    Figure 10

    Experimental setup and calibration technique. MW, microwave. RT, room temperature.

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