research-article

Magnetic Core TSV-Inductor Design and Optimization for On-chip DC-DC Converter

Authors:

Umamaheswara Rao Tida,

Cheng ZhuoAuthors Info & Claims

ACM Transactions on Design Automation of Electronic Systems (TODAES), Volume 27, Issue 5

Article No.: 52, Pages 1 - 23

https://doi.org/10.1145/3507700

Published: 06 June 2022 Publication History

Abstract

The conventional on-chip spiral inductor consumes a significant top-metal routing area, thereby preventing its popularity in many on-chip applications. Recently through-silicon-via– (TSV) based inductor (also known as a TSV-inductor) with a magnetic core has been proved to be a viable option for the on-chip DC-DC converter. The operating conditions of these inductors play a major role in maximizing the performance and efficiency of the DC-DC converter. However, there is a critical need to study the design and optimization details of magnetic core TSV-inductors with the unique three-dimensional structure embedding magnetic core. This article aims to provide a clear understanding of the modeling details of a magnetic core TSV-inductor and a design and optimization methodology to assist efficient inductor design. Moreover, a machine learning–assisted model combining physical details and artificial neural network is also proposed to extract the equivalent circuit to further facilitate DC-DC converter design. Experimental results show that the optimized TSV-inductor with the magnetic core and air-gap can achieve inductance density improvement of up to 7.7 \(\times\) and quality factor improvements of up to 1.6 \(\times\) for the same footprint compared with the TSV-inductor without a magnetic core. For on-chip DC-DC converter applications, the converter efficiency can be improved by up to 15.9% and 6.8% compared with the conventional spiral and TSV-inductor without magnetic core, respectively.

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Cited By

Jayaswal KPalwalia DGuerrero J(2023)Design and Reliability Assessment of Inductor for Non-isolated DC-DC Buck Converter2023 First International Conference on Advances in Electrical, Electronics and Computational Intelligence (ICAEECI)10.1109/ICAEECI58247.2023.10370977(1-8)Online publication date: 19-Oct-2023
https://doi.org/10.1109/ICAEECI58247.2023.10370977
Wang HXiong YGeng L(2023)Modeling and Thermal Stress Coupling Optimization Design of TSV Inductors in On-Chip DC/DC ConvertersIEEE Access10.1109/ACCESS.2023.333670511(133189-133198)Online publication date: 2023
https://doi.org/10.1109/ACCESS.2023.3336705
Elma MVemuri MTida U(2023)Design, Analysis and Optimization of Magnetic-Core Solenoid Inductor for On-Chip Multi-Phase Buck ConverterIEEE Access10.1109/ACCESS.2023.328135911(90563-90574)Online publication date: 2023
https://doi.org/10.1109/ACCESS.2023.3281359
Show More Cited By

Index Terms

Magnetic Core TSV-Inductor Design and Optimization for On-chip DC-DC Converter
1. Hardware
  1. Electronic design automation
    1. Modeling and parameter extraction
  2. Integrated circuits
    1. 3D integrated circuits

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Published In

cover image ACM Transactions on Design Automation of Electronic Systems

ACM Transactions on Design Automation of Electronic Systems Volume 27, Issue 5

September 2022

274 pages

ISSN:1084-4309

EISSN:1557-7309

DOI:10.1145/3540253

Editor:
X. Sharon Hu
University of Notre Dame, USA

Issue’s Table of Contents

Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected].

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ACM Journals for the Design of Smart and Connected Systems

Publication History

Published: 06 June 2022

Online AM: 07 March 2022

Accepted: 01 December 2021

Revised: 01 November 2021

Received: 01 July 2021

Published in TODAES Volume 27, Issue 5

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National Natural Science Foundation of China
Key Area R&D Program of Guangdong Province

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Cited By

Jayaswal KPalwalia DGuerrero J(2023)Design and Reliability Assessment of Inductor for Non-isolated DC-DC Buck Converter2023 First International Conference on Advances in Electrical, Electronics and Computational Intelligence (ICAEECI)10.1109/ICAEECI58247.2023.10370977(1-8)Online publication date: 19-Oct-2023
https://doi.org/10.1109/ICAEECI58247.2023.10370977
Wang HXiong YGeng L(2023)Modeling and Thermal Stress Coupling Optimization Design of TSV Inductors in On-Chip DC/DC ConvertersIEEE Access10.1109/ACCESS.2023.333670511(133189-133198)Online publication date: 2023
https://doi.org/10.1109/ACCESS.2023.3336705
Elma MVemuri MTida U(2023)Design, Analysis and Optimization of Magnetic-Core Solenoid Inductor for On-Chip Multi-Phase Buck ConverterIEEE Access10.1109/ACCESS.2023.328135911(90563-90574)Online publication date: 2023
https://doi.org/10.1109/ACCESS.2023.3281359
Wu YWen CYin XZhuo C(2023)LMM: A Fixed-Point Linear Mapping Based Approximate Multiplier for IoTJournal of Computer Science and Technology10.1007/s11390-023-2572-838:2(298-308)Online publication date: 30-Mar-2023
https://dl.acm.org/doi/10.1007/s11390-023-2572-8

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