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Wafer Curvature and Flatness Measurements Using The Magic-Mirror (Makyoh) Method

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Abstract

A new method is presented for the measurement of the radii of curvature R of semiconductor wafers using the magic-mirror (Makyoh) technique. A flat mirror is placed beneath the sample, thus a second, “contour” image of the sample is formed beside the Makyoh image. From the ratio of the two image sizes, R can be determined using a set of reference curved mirrors. Model calculations show good agreement with the results. Other examples of assessing of the flatness of semiconductor samples are presented as well.

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Correspondence to Ferenc Riesz.

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SzabÓ, J., Riesz, F. & SzentpÁli, B. Wafer Curvature and Flatness Measurements Using The Magic-Mirror (Makyoh) Method. MRS Online Proceedings Library 379, 103–108 (1995). https://doi.org/10.1557/PROC-379-103

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  • DOI: https://doi.org/10.1557/PROC-379-103