... Silicon chip with sealing ring on Mo substrate bolted on Al cooling plate. Finite element mod... more ... Silicon chip with sealing ring on Mo substrate bolted on Al cooling plate. Finite element model for one-quarter of the photonic package. Creep strain rate versus stress of 48Sn-52In solder.Temperature cycling condition. Creep hysteresis loops (shear stress versus shear creep ...
... Silicon chip with sealing ring on Mo substrate bolted on Al cooling plate. Finite element mod... more ... Silicon chip with sealing ring on Mo substrate bolted on Al cooling plate. Finite element model for one-quarter of the photonic package. Creep strain rate versus stress of 48Sn-52In solder.Temperature cycling condition. Creep hysteresis loops (shear stress versus shear creep ...
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