glass epoxy boardとは 意味・読み方・使い方

A laminated wiring board 11 is a multilayered copper-plated laminated wiring board which is, for instance, composed of a glass epoxy resin as a mother material and a five or more-layered copper wiring pattern formed on the glass epoxy resin.例文帳に追加

積層配線板１１は、例えばガラスエポキシ樹脂を母材とし５層以上の銅配線パターンが形成された多層の銅張積層配線板である。 - 特許庁

The mother board is a multilayered printed wiring board equipped with an insulating layer comprising a glass/epoxy resin or the like and a plurality of conductor layers comprising copper foils.例文帳に追加

マザーボード１０はガラスエポキシ樹脂等から成る絶縁層と銅箔から成る複数の導体層を備える多層プリント配線板である。 - 特許庁

A circuit board 20 with a pressure sensor 11 mounted thereon is a glass/epoxy-resin board with a through hole 23 formed therein.例文帳に追加

圧力センサ１１が実装される回路基板２０はガラス・エポキシ樹脂基板であり貫通孔２３が形成される。 - 特許庁

To provide a method of manufacturing printed board by which the coefficient of heat contraction of a glass epoxy-based printed board can be suitably made uniform at every substrate.例文帳に追加

ガラスエポキシ系プリント基板の熱収縮率を基材毎に一律にするのに好適なプリント基板の製造方法を提供する。 - 特許庁

When a semiconductor device is bonded to a glass epoxy board by an ultrasonic welding manufacturing of a mounted board is made by applying ultrasonic vibrations to the semiconductor device and bonding by ultrasonic welding while heating at a lower temperature than a glass transition temperature of a bond which bonds a wiring pattern on a glass epoxy resin and at a temperature higher than a softening point of the glass epoxy resin.例文帳に追加

ガラスエポキシ基板へ半導体装置を超音波圧着接合する場合に、配線パターンをガラスエポキシ樹脂へ接着している接着剤のガラス転移温度より低い温度で、かつガラスエポキシ樹脂の軟化点以上の温度で加熱しながら半導体装置に超音波振動を印加し超音波圧着接合を行い実装体の製造を行う。 - 特許庁

A reverse F-shaped antenna pattern where a feeding conductive pattern is connected to a feeding transmission path formed on the surface of a glass epoxy board and a ground conductive pattern is connected to a conductive part for ground formed on the surface of the glass epoxy board is formed as a driven element on the surface of the glass epoxy board.例文帳に追加

ガラスエポキシ基板の表面に形成された給電伝送路に給電導電パターンが接続されるとともに、同じくガラスエポキシ基板の表面に形成された接地用導電部に接地導電パターンが接続された逆Ｆ形状アンテナパターンを、ガラスエポキシ基板の表面に励振素子として形成する。 - 特許庁

In this method of manufacturing the glass epoxy-based printed board provided with a connecting terminal (for example, a TAB terminal), the printed board is subjected to heat treatment at a temperature higher than the glass transition point after the board is completed.例文帳に追加

接続端子（例えば、ＴＡＢ端子）を備えたガラスエポキシ系プリント基板の製造方法において、前記プリント基板の完成後、当該基板にガラス転移温度を超える加熱処理を施す。 - 特許庁

The glass fiber substrate epoxy resin laminated sheet obtained by laying electrically insulating films on both sides of an epoxy resin prepreg in which a glass fiber substrate is impregnated with an epoxy resin to overlap each other and heating/pressing/molding them is used as the reinforcing material of the flexible printed circuit board.例文帳に追加

ガラス繊維基材にエポキシ樹脂を含浸させたエポキシ樹脂プリプレグの両面に、電気絶縁性フイルムを重ねて加熱加圧成形したガラス繊維基材エポキシ樹脂積層板を、フレキシブルプリント配線板の補強材とする。 - 特許庁