A 16nm 256-bit wide 89.6GByte/s total bandwidth in-package interconnect with 0.3V swing and 0.062pJ/bit power in InFO package ; INSPEC Accession Number:.

A 16nm 256-bit wide 89.6GByte/s total bandwidth in-package interconnect with 0.3V swing and 0.062pJ/bit power in InFO package · M. Lin, Chien-Chun Tsai, +11 ...

A 16nm 256-bit Wide 89.6GByte/s Total Bandwidth. In-Package Interconnect with 0.3V Swing and. 0.062pJ/bit Power in InFO Package. Mu-Shan Lin, Chien-Chun Tsai ...

A 16nm 256-bit wide 89.6GByte/s total bandwidth in-package interconnect with 0.3V swing and 0.062pJ/bit power in InFO package. August 2016. August 2016.

A 16nm 256-bit wide 89.6GByte/s total bandwidth in-package interconnect with 0.3V swing and 0.062pJ/bit power in InFO package. Mu-Shan Lin,Chien-Chun Tsai ...

A 16nm 256-bit Wide 89.6GByte/s Total Bandwidth In-Package Interconnect with 0.3V Swing and 0.062pJ/bit Power in InFO Package. https://bit.ly/3JNWWCr #DRAM ...

A 16nm 256-bit wide 89.6GByte/s total bandwidth in-package interconnect with 0.3V swing and 0.062pJ/bit power in InFO package. ... bit core in a sub-10mm package ...

A 16nm. 256-bit wide 89.6gbyte/s total bandwidth in-package interconnect with 0.3v swing and 0.062pj/bit power in info package. In 2016 IEEE Hot Chips 28.

Yamada, “A. 16nm 256-bit wide 89.6gbyte/s total bandwidth in-package interconnect with 0.3v swing and 0.062pj/bit power in info package,” in IEEE Hot. Chips ...

Interconnects, A 16nm 256-bit Wide 89.6GByte/s Total Bandwidth In-Package Interconnect with 0.3V Swing and 0.062pJ/bit Power in InFO Package, Mu-Shan Lin, TSMC.