In this paper, a novel wafer level packaging solution for microelectromechanical system (MEMS) device is reported. Microfabrication processes were developed ...
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In this paper, a novel wafer level packaging solution for microelectromechanical system (MEMS) device is reported. Microfabrication processes were developed ...
Nov 5, 2007 · To satisfy this demand, this paper presents a novel method for hermetic and near-vacuum packaging of MEMS devices. We use wafer-level bonding ...
This paper introduces a robust and cost-effective solution for heterogeneous 3D integration. View. Show abstract. Note: High temperature pressure sensor for ...
A novel wafer level package strategy for RF MEMS is presented in this paper, considering the important issues such as the seal material, RF feedthrough and ...
Bibliographic details on A Novel Wafer-Level Packaging Solution For Mems.
The packaging process involves bonding a capping wafer to the MEMS wafer before dicing. This provides a stable and hermetically sealed environment for robust ...
A novel surface activation technology for Cu-Cu bonding-based wafer-level vacuum packaging using hot-wire-generated atomic hydrogen treatment was developed.
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A radio-frequency micro-electro-mechanical system (RF MEMS) wafer-level packaging (WLP) method using pre-patterned benzo-cyclo-butene (BCB) polymers with a ...
... packaging technique for MEMS devices. The book will also aid in stimulating further research and development in optical, electrical, and thermal designs as ...
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