In this paper, we propose a technique for bumping Sn/3.5Ag, a binary tin compound with an eutectic temperature of 221 °C.
Binary and ternary tin alloys are promising candidates to substitute lead-content components. In this paper, we describe an electroplating technique for high ...
The rate of Ag deposition onto the bump depends on various processing parameters like current density, agitation and temperature. Among these parameters, the Ag ...
Environmental concerns as well as legal constraints have been pushing research on flip chip technology towards the development of lead-free solders and also ...
Oct 22, 2024 · The rate of Ag deposition onto the bump depends on various processing parameters like current density, agitation and temperature. Among these ...
The Sn-Ag alloy bumps with a composition near the eutectic composition. (~3.5%Ag) are obtained in the range of current densities from 1 to 1.5 A/dm2. At a high ...
In this study, the properties of electroplating plating Sn-2.3Ag solder bumps fabricated by several plating and reflow conditions have been investigated ...
Aug 20, 2009 · Eutectic Sn 3.5 wt % Ag alloy is one of the most promising lead-free solders in wafer bumping for flip-chip interconnection. Its ...
Bump formation.— Sn–Ag solder bumps were produced on test wafers, which were made of glass for experimentation. A schematic diagram of the electroplating ...
Missing: Characterisation electroplated
Abstract: This paper describes a technique that can obtain ternary Sn–Ag–In solder bumps with fine pitch and homogenous composition distribution.
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