The front end adopts a dual-channel superheterodyne structure, two GaAs downconverter chips and a power divider chip are integrated on the silicon substrate ...
Jan 10, 2024 · The front end adopts a dual-channel superheterodyne structure, two GaAs downconverter chips and a power divider chip are integrated on the ...
This letter presents a Ka-band receiver front end in the form of system in package using silicon substrate. The front end adopts a dual-channel ...
実験的サービス公開サイトであるCiNii Labsを公開しました。 Design of a Ka-band receiver front end using Si-based system in package.
This paper presents the design procedure for a broadband silicon-based stacked patch antenna in Ka-band, which realizes a practical AiP structure for phased- ...
Missing: front end
Jun 18, 2024 · Design of a Ka-Band Single-Chip Front-End based on a 100 nm GaN-on-Si technology ... A Ku-Band GaN-on-Si MMIC Power Amplifier with an Asymmetrical ...
Design of a Ka-band receiver front end using Si-based system in package. Hanxiang Zhu, Jun Li, Qidong Wang, Liqiang Cao. Circuits and modules for storage ...
ABSTRACT This paper proposes a Ka-band receiver front-end for future CubeSats Low-Earth Orbit (LEO) to Geostationary (GEO) inter-satellite links.
In this letter, a silicon-based package design is proposed for E-band communication systems. In order to obtain ex- cellent RF performance, the discontinuous ...
Missing: receiver | Show results with:receiver
The design and implementation of a low-profile, high-performance, and highly integrated Ka-band phased array antenna T/R module are examined in this paper.